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首页> 美国卫生研究院文献>Materials >Mold–Slug Interfacial Heat Transfer Characteristics of Different Coating Thicknesses: Effects on Slug Temperature and Microstructure in Swirled Enthalpy Equilibration Device Process
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Mold–Slug Interfacial Heat Transfer Characteristics of Different Coating Thicknesses: Effects on Slug Temperature and Microstructure in Swirled Enthalpy Equilibration Device Process

机译：不同涂层厚度的模-耳界面传热特性：旋流焓平衡装置过程中对料温度和微观结构的影响

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摘要

Application of a coating on a mold surface is widely used in the foundry industry. Changes in coating change the heat transfer at the mold–melt interface, which influences the microstructure of the casting. In this study, the effect of boron nitride coating thickness on the interfacial heat transfer and slug microstructure in the Swirled Enthalpy Equilibration Device (SEED) process was investigated. The temperatures of the semi-solid slug and mold were measured, and the interfacial heat transfer coefficient and heat flux of the mold–slug interface was estimated based on these data. Microstructures of the quenched slugs were also examined. The results indicated that the interfacial heat transfer coefficient decreased with an increase in coating thickness and was sensitive to a coating thickness of less than 0.1 mm. The interfacial heat flux decreased sharply at the early stage, and then slowed down as the swirling time increased and the coating thickened. The coating thickness affected the temperature evolution of the slug at the early stage of the SEED process. As the coating thickness increased from near zero to 1.0 mm, the grain size of the slug increased by ~20 µm and the globular structure of the slug transformed into a dendritic structure.
机译：在铸造表面上广泛使用涂料。涂层的变化会改变铸模与熔体界面的传热，从而影响铸件的微观结构。在这项研究中，研究了旋涡焓平衡装置（SEED）工艺中氮化硼涂层厚度对界面传热和块状微结构的影响。测量了半固态团块和铸模的温度，并根据这些数据估算了结晶器-团块界面的界面传热系数和热通量。还检查了淬火段塞的微观结构。结果表明，界面传热系数随着涂层厚度的增加而降低，并且对小于0.1mm的涂层厚度敏感。界面热通量在早期阶段急剧下降，然后随着旋流时间的增加和涂层的增厚而减慢。在SEED过程的早期阶段，涂层厚度影响了块料的温度变化。随着涂层厚度从接近零增加到1.0 mm，团块的晶粒尺寸增加了约20 µm，团块的球状结构转变为树枝状结构。

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