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Effect of slurry composition on the chemical mechanical polishing of thin diamond films

机译：浆料组成对金刚石薄膜化学机械抛光的影响

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摘要

Nanocrystalline diamond (NCD) thin films grown by chemical vapour deposition have an intrinsic surface roughness, which hinders the development and performance of the films’ various applications. Traditional methods of diamond polishing are not effective on NCD thin films. Films either shatter due to the combination of wafer bow and high mechanical pressures or produce uneven surfaces, which has led to the adaptation of the chemical mechanical polishing (CMP) technique for NCD films. This process is poorly understood and in need of optimisation. To compare the effect of slurry composition and pH upon polishing rates, a series of NCD thin films have been polished for three hours using a Logitech Ltd. Tribo CMP System in conjunction with a polyester/polyurethane polishing cloth and six different slurries. The reduction in surface roughness was measured hourly using an atomic force microscope. The final surface chemistry was examined using X-ray photoelectron spectroscopy and a scanning electron microscope. It was found that of all the various properties of the slurries, including pH and composition, the particle size was the determining factor for the polishing rate. The smaller particles polishing at a greater rate than the larger ones.
机译：通过化学气相沉积法生长的纳米晶金刚石（NCD）薄膜具有固有的表面粗糙度，这会阻碍膜的各种应用的发展和性能。传统的金刚石抛光方法对NCD薄膜无效。薄膜要么由于晶圆弯曲和高机械压力的组合而破碎，要么产生不平坦的表面，这导致化学机械抛光（CMP）技术适用于NCD薄膜。这个过程了解甚少，需要优化。为了比较浆料组成和pH值对抛光速率的影响，已使用Logitech Ltd. Tribo CMP系统结合聚酯/聚氨酯抛光布和六种不同浆料对一系列NCD薄膜进行了三个小时的抛光。使用原子力显微镜每小时测量一次表面粗糙度的降低。使用X射线光电子能谱和扫描电子显微镜检查最终的表面化学。已经发现，在浆料的所有各种性质中，包括pH和组成，粒径是抛光速率的决定因素。较小的粒子比较大的粒子抛光速率更高。

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