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首页> 美国卫生研究院文献>Sensors (Basel Switzerland) >Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures
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Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures

机译：高温下具有密封腔的微机械加工的硅膜片的塑性变形

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摘要

Single crystal silicon (SCS) diaphragms are widely used as pressure sensitive elements in micromachined pressure sensors. However, for harsh environments applications, pure silicon diaphragms are hardly used because of the deterioration of SCS in both electrical and mechanical properties. To survive at the elevated temperature, the silicon structures must work in combination with other advanced materials, such as silicon carbide (SiC) or silicon on insulator (SOI), for improved performance and reduced cost. Hence, in order to extend the operating temperatures of existing SCS microstructures, this work investigates the mechanical behavior of pressurized SCS diaphragms at high temperatures. A model was developed to predict the plastic deformation of SCS diaphragms and was verified by the experiments. The evolution of the deformation was obtained by studying the surface profiles at different anneal stages. The slow continuous deformation was considered as creep for the diaphragms with a radius of 2.5 mm at 600 °C. The occurrence of plastic deformation was successfully predicted by the model and was observed at the operating temperature of 800 °C and 900 °C, respectively.
机译：单晶硅（SCS）膜片被广泛用作微机械压力传感器中的压敏元件。但是，在恶劣的环境中，由于SCS的电气和机械性能都会下降，因此几乎不使用纯硅膜片。为了在高温下生存，硅结构必须与其他先进材料结合使用，例如碳化硅（SiC）或绝缘体上硅（SOI），以提高性能并降低成本。因此，为了扩展现有SCS微结构的工作温度，这项工作研究了加压SCS隔膜在高温下的机械性能。建立了预测SCS膜片塑性变形的模型，并通过实验进行了验证。通过研究不同退火阶段的表面轮廓来获得变形的演变。对于600°C半径为2.5 mm的膜片，缓慢的连续变形被视为蠕变。该模型成功预测了塑性变形的发生，并且分别在800°C和900°C的工作温度下观察到了塑性变形。

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