Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching

机译：通过硅晶片键合用于使用TMAH蚀刻形成所需厚度的微观结构的微机械晶片

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The present research report a fabrication process of suspended silicon microstructures of desired thickness over controlled depth micromachined cavities. The process is developed using direct wafer bonding to seal the micromachined cavities and wet anisotropic etching in pure and surfactant added tetramethyl ammonium hydroxide (TMAH) solutions. Wet anisotropic etching is used for the formation of cavities, thinning down the wafer for structural layer and releasing the structures. Non-ionic surfactant Triton-X-100 [C14H22O(C2H4O)n] added TMAH is used to realize the microstructures with rounded concave and sharp convex corners.

机译：本研究报告了在受控深度微机械腔中所需厚度的悬浮硅微结构的制造过程。该方法是使用直接晶片键合开发的，以密封微机械腔并在纯和表面活性剂中加入的四甲基氢氧化铵（TMAH）溶液中的湿各向异性蚀刻。湿的各向异性蚀刻用于形成空腔，缩短晶片以进行结构层并释放结构。非离子表面活性剂Triton-X-100 [C 14 H 22 O（C 2 H 4 O） N ]添加TMAH用于实现圆形凹凸和尖锐凸角的微观结构。

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《International Symposium on Micro-NanoMechatronics and Human Science》|2008年||共5页
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Pal Prem; Sato Kazuo;
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1. Design of sealed cavity microstructures formed by silicon wafer bonding [J] . Huff M.A., Nikolich A.D. Journal of Microelectromechanical Systems . 1993,第2期

机译：硅片键合形成的密封腔微结构设计
2. Formation of silicon reentrant cavity heat sinks using anisotropic etching and direct wafer bonding [J] . Goyal A., Jaeger R.C. IEEE Electron Device Letters . 1993,第1期

机译：利用各向异性蚀刻和直接晶圆键合形成硅凹腔散热片
3. Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures [J] . Ren Juan, Ward Michael, Kinnell Peter, SIAM journal on applied dynamical systems . 2017,第2期

机译：微机械硅膜片的塑性变形，在高温下具有密封腔的密封腔
4. Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching [C] . Pal Prem, Sato Kazuo International Symposium on Micro-NanoMechatronics and Human Science . 2008

机译：通过硅晶片键合用于使用TMAH蚀刻形成所需厚度的微观结构的微机械晶片
5. Electrical through-wafer interconnects and microfabricated cantilever arrays using through-wafer silicon etching. [D] . Chow, Eugene Michael. 2001

机译：晶圆上电互连和使用晶圆硅刻蚀的微型悬臂阵列。
6. Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures [O] . Juan Ren, Michael Ward, Peter Kinnell, 2016

机译：高温下具有密封腔的微机械加工的硅膜片的塑性变形
7. Plastic deformation of micromachined silicon diaphragms with a sealed cavity at high temperatures [O] . Ren, J., Ward, M., Kinnell, P., 2016

机译：具有密封腔的微加工硅膜片在高温下的塑性变形
8. Aerospace Sensor Component and Subsystem Investigation and Innovation-2 Component Exploration and Development (ASCSII-2 CED) Delivery Order 0003: Hermetically Sealed Cavities in 3-D GaAs-Silicon and Silicon-Silicon Packages for Microelectromechanical System (MEMS) Devices Using Selective and Large-Scale Bonding [R] . Malshe, A. P. 2003

机译：航空航天传感器组件和子系统调查与创新-2组件探索与开发（asCsII-2 CED）交付订单0003：采用选择性和大型的微机电系统（mEms）器件的三维Gaas硅和硅硅封装的气密密封腔 - 规模粘合

Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching

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