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Development of a Non-Invasive On-Chip Interconnect Health Sensing Method Based on Bit Error Rates

机译：基于误码率的非侵入式片上互连健康感测方法的开发

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摘要

Electronic products and systems are widely used in industrial network systems, control devices, and data acquisition devices across many industry sectors. Failures of such electronic systems might lead to unexpected downtime, loss of productivity, additional work for repairs, and delay in product and service development. Thus, developing an appropriate sensing technique is necessary, because it is the first step in system fault diagnosis and prognosis. Many sensing techniques often require external and additional sensing devices, which might disturb system operation and consequently increase operating costs. In this study, we present an on-chip health sensing method for non-destructive and non-invasive interconnect degradation detection. Bit error rate (BER), which represents data integrity during digital signal transmission, was selected to sense interconnect health without connecting external sensing devices. To verify the health sensing performance, corrosion tests were conducted with in situ monitoring of the BER and direct current (DC) resistance. The eye size, extracted from the BER measurement, showed the highest separation between the intact and failed interconnect, as well as a gradual transition, compared with abrupt changes in the DC resistance, during interconnect degradation. These experimental results demonstrate the potential of the proposed sensing method for on-chip interconnect health monitoring applications without disturbing system operation.
机译：电子产品和系统广泛应用于许多行业的工业网络系统，控制设备和数据采集设备中。此类电子系统的故障可能会导致意外停机，生产力下降，维修工作量增加以及产品和服务开发延迟。因此，开发一种合适的传感技术是必要的，因为它是系统故障诊断和预后的第一步。许多传感技术通常需要外部和附加的传感设备，这可能会干扰系统运行并因此增加运行成本。在这项研究中，我们提出了一种用于非破坏性和非侵入性互连退化检测的片上健康感测方法。选择了误码率（BER）来表示数字信号传输期间的数据完整性，以便在不连接外部传感设备的情况下检测互连状况。为了验证健康感测性能，对BER和直流（DC）电阻进行了现场监测，进行了腐蚀测试。从BER测量中提取出的眼图大小显示出与互连退化期间直流电阻的突然变化相比，完整互连和故障互连之间的最大间距以及逐渐过渡。这些实验结果证明了所提出的传感方法在片上互连健康监测应用中的潜力，而不会干扰系统运行。

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