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Super-Wide Impedance Bandwidth Planar Antenna for Microwave and Millimeter-Wave Applications

机译:用于微波和毫米波应用的超宽阻抗带宽平面天线

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摘要

A feasibility study of a novel configuration for a super-wide impedance planar antenna is presented based on a 2 × 2 microstrip patch antenna (MPA) using CST Microwave Studio. The antenna comprises a symmetrical arrangement of four-square patches that are interconnected to each other with cross-shaped high impedance microstrip lines. The antenna array is excited through a single feedline connected to one of the patches. The proposed antenna array configuration overcomes the main drawback of conventional MPA with a narrow bandwidth that is typically <5%. The antenna exhibits a super-wide frequency bandwidth from 20 GHz to 120 GHz for S11 < −15 dB, which corresponds to a fractional bandwidth of 142.85%. The antenna’s performance of bandwidth, impedance match, and radiation gain were enhanced by etching slots on the patches. With the inclusion of the slot, the maximum radiation gain and efficiency of the MPA increased to 15.11 dBi and 85.79% at 80 GHz, which showed an improvement of 2.58 dBi and 12.54%, respectively. The dimension of each patch antenna was 4.3 × 5.3 mm2. The results showed that the proposed MPA is useful for various existing and emerging communication systems such as ultra-wideband (UWB) communications, RFID systems, massive multiple-output multiple-input (MIMO) for 5G, and radar systems.
机译:基于使用CST Microwave Studio的2×2微带贴片天线(MPA),提出了一种针对超宽阻抗平面天线的新型配置的可行性研究。天线包括对称的四角形贴片,它们通过十字形高阻抗微带线相互连接。天线阵列通过连接到贴片之一的单条馈线激励。所提出的天线阵列配置克服了常规MPA的主要缺点,其窄带宽通常小于5%。对于S11 <-15 dB,天线表现出从20 GHz到120 GHz的超宽频率带宽,这相当于142.85%的分数带宽。通过在贴片上刻槽,可以增强天线的带宽,阻抗匹配和辐射增益性能。加上该插槽,MPA的最大辐射增益和效率在80 GHz时分别提高到15.11 dBi和85.79%,分别提高了2.58 dBi和12.54%。每个贴片天线的尺寸为4.3×5.3 mm 2 。结果表明,拟议的MPA可用于各种现有和新兴的通信系统,例如超宽带(UWB)通信,RFID系统,用于5G的大规模多输出多输入(MIMO)和雷达系统。

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