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首页> 美国卫生研究院文献>Applied and Environmental Microbiology >Contact Killing of Bacteria on Copper Is Suppressed if Bacterial-Metal Contact Is Prevented and Is Induced on Iron by Copper Ions
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Contact Killing of Bacteria on Copper Is Suppressed if Bacterial-Metal Contact Is Prevented and Is Induced on Iron by Copper Ions

机译：如果防止细菌与金属的接触并通过铜离子在铁上引起细菌-金属接触则可以抑制铜上细菌的接触杀伤。

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Bacteria are rapidly killed on copper surfaces, and copper ions released from the surface have been proposed to play a major role in the killing process. However, it has remained unclear whether contact of the bacteria with the copper surface is also an important factor. Using laser interference lithography, we engineered copper surfaces which were covered with a grid of an inert polymer which prevented contact of the bacteria with the surface. Using Enterococcus hirae as a model organism, we showed that the release of ionic copper from these modified surfaces was not significantly reduced. In contrast, killing of bacteria was strongly attenuated. When E. hirae cells were exposed to a solid iron surface, the loss of cell viability was the same as on glass. However, exposing cells to iron in the presence of 4 mM CuSO4 led to complete killing in 100 min. These experiments suggest that contact killing proceeds by a mechanism whereby the metal-bacterial contact damages the cell envelope, which, in turn, makes the cells susceptible to further damage by copper ions.
机译：细菌在铜表面上迅速被杀死，并且有人提出从表面释放的铜离子在杀死过程中起主要作用。但是，尚不清楚细菌与铜表面的接触是否也是重要的因素。使用激光干涉光刻技术，我们设计了铜表面，这些表面被惰性聚合物网格覆盖，从而防止细菌与表面接触。使用平肠肠球菌作为模型生物，我们表明从这些修饰的表面释放的离子铜并未显着减少。相反，细菌的杀死被大大减弱。当E. hirae细胞暴露于固体铁表面时，细胞活力的丧失与玻璃上的丧失相同。但是，在4 mM CuSO4存在下将细胞暴露于铁导致100分钟内完全杀死。这些实验表明，通过金属细菌接触破坏细胞包膜的机制进行接触杀伤，从而使细胞易于受到铜离子的进一步破坏。

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