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Surface analysis and depth profiling using time-of-flight elastic recoil detection analysis with argon sputtering

机译:使用飞行时间弹性反冲检测分析和氩气溅射进行表面分析和深度分析

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摘要

The recent development of new advanced materials demands extensive effort in developing new analytical techniques that can provide insight into material composition at the nanoscale, particularly at surfaces and interfaces, which is important for both fabrication and material performance. Here, we present a proof of principle for a new setup used for thin-film characterisation and depth profiling based on a combination of time-of-flight elastic recoil detection analysis (TOF-ERDA) and Ar sputtering. A quantitative depth profiling with a best achievable surface depth resolution of ~2 nm can be realised for the entire layer, which is important for the precise determination of thickness and composition of samples that are several tenths of a nanometre thick. The performance of TOF-ERDA with Ar sputtering was demonstrated using 15 nm Cu evaporated onto a Si substrate. The advantages and limits of the method are discussed in detail.
机译:新的先进材料的最新发展要求开发新的分析技术需要大量的精力,这些分析技术可以洞察纳米级的材料成分,尤其是在表面和界面,这对制造和材料性能都至关重要。在这里,我们基于飞行时间弹性反冲检测分析(TOF-ERDA)和Ar溅射技术的结合,为用于薄膜表征和深度分析的新装置提供了原理证明。可以对整个层实现定量的深度剖析,其最佳可实现的表面深度分辨率约为2?nm,这对于精确确定十分之一纳米厚的样品的厚度和成分非常重要。使用在Si衬底上蒸发的15 nm Cu证明了采用Ar溅射的TOF-ERDA的性能。详细讨论了该方法的优点和局限性。

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