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首页> 美国卫生研究院文献>Scientific Reports >Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
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Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

机译：温度梯度下Cu / Sn / Cu互连中液-固界面处Cu6Sn5金属间化合物的生长动力学

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摘要

The growth behavior of intermetallic compounds (IMCs) at the liquid-solid interfaces in Cu/Sn/Cu interconnects during reflow at 250 °C and 280 °C on a hot plate was investigated. Being different from the symmetrical growth during isothermal aging, the interfacial IMCs showed clearly asymmetrical growth during reflow, i.e., the growth of Cu6Sn5 IMC at the cold end was significantly enhanced while that of Cu3Sn IMC was hindered especially at the hot end. It was found that the temperature gradient had caused the mass migration of Cu atoms from the hot end toward the cold end, resulting in sufficient Cu atomic flux for interfacial reaction at the cold end while inadequate Cu atomic flux at the hot end. The growth mechanism was considered as reaction/thermomigration-controlled at the cold end and grain boundary diffusion/thermomigration-controlled at the hot end. A growth model was established to explain the growth kinetics of the Cu6Sn5 IMC at both cold and hot ends. The molar heat of transport of Cu atoms in molten Sn was calculated as + 11.12 kJ/mol at 250 °C and + 14.65 kJ/mol at 280 °C. The corresponding driving force of thermomigration in molten Sn was estimated as 4.82 × 10−19 N and 6.80 × 10−19 N.
机译：研究了在250°C和280°C的热板上回流过程中，Cu / Sn / Cu互连中液-固界面处金属间化合物（IMC）的生长行为。与等温时效过程中的对称生长不同，界面IMC在回流过程中表现出明显的不对称生长，即在冷端Cu6Sn5 IMC的生长显着增强，而在高温端则阻碍了Cu3Sn IMC的生长。发现温度梯度引起Cu原子从热端向冷端的质量迁移，导致足够的Cu原子通量用于在冷端的界面反应，而在热端的Cu原子通量不足。生长机理被认为是在冷端控制反应/热迁移，而在热端控制晶界扩散/热迁移。建立了生长模型以解释Cu6Sn5 IMC在冷端和热端的生长动力学。在250℃下，Cu原子在熔融的Sn中的传输摩尔热为+ 11.12 kJ / mol，在280 C下+ 14.65 kJ / mol。估计熔融锡中热迁移的相应驱动力为4.82×10 −19 N和6.80×10 −19 N。

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