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首页> 美国卫生研究院文献>Materials >Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. Solder Alloy Inoculated with InSb
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Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. Solder Alloy Inoculated with InSb

机译：重结晶对99.3Sn–0.7Cu wt中β向α-Sn同素异形转变的影响。 InSb接种的％焊料合金

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摘要

The effect of recrystallization of 99.3Sn–0.7Cu wt. % solder alloy on the allotropic transition of β to α-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 °C for 72 h, which caused the recrystallization of the alloy. The samples were stored at −10 and −20 °C. The β-Sn to α-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the β-Sn to α-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of β-Sn to α-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample.
机译：99.3Sn–0.7Cu重量的重结晶作用。研究了％焊料合金对β到α-Sn的同素异形转变（所谓的锡害现象）的影响。准备大量样品，然后将InSb接种器机械应用于其表面以增强过渡。一半样品用作参比材料，另一半在180°C退火72 h，这导致合金重结晶。样品分别储存在-10和-20°C下。使用电阻测量监测从β-Sn到α-Sn的转变。使用扫描电子显微镜研究了从β-Sn到α-Sn过渡过程中锡晶粒的膨胀和分离。合金的再结晶大大地抑制了锡害虫现象，因为它减少了可能发生β-Sn向α-Sn转变的不均匀形核的晶体结构中的缺陷数量。在接种InSb的情况下，过渡向本体的扩散与平行于样品表面的扩散一样快。

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