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Stress and Microstructure Evolution in Mo Thin Films without or with Cover Layers during Thermal-Cycling

机译:莫薄膜的应力和微观结构演化覆盖层在热循环期间

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摘要

The intrinsic stress behavior and microstructure evolution of Molybdenum thin films were investigated to evaluate their applicability as a metallization in high temperature microelectronic devices. For this purpose, 100 nm thick Mo films were sputter-deposited without or with an AlN or SiO2 cover layer on thermally oxidized Si substrates. The samples were subjected to thermal cycling up to 900 °C in ultrahigh vacuum; meanwhile, the in-situ stress behavior was monitored by a laser based Multi-beam Optical Sensor (MOS) system. After preannealing at 900 °C for 24 h, the uncovered films showed a high residual stress at room temperature and a plastic behavior at high temperatures, while the covered Mo films showed an almost entirely elastic deformation during the thermal cycling between room temperature and 900 °C with hardly any plastic deformation, and a constant stress value during isothermal annealing without a notable creep. Furthermore, after thermal cycling, the Mo films without as well as with a cover layer showed low electrical resistivity (≤10 μΩ·cm).
机译:研究了钼薄膜的内在应力行为和微观结构演化,以评估它们在高温微电子器件中的金属化的适用性。为此目的,在热氧化的Si衬底上溅射沉积100nm厚的Mo膜而没有或用AlN或SiO 2覆盖层溅射。将样品在超高真空中进行高达900℃的热循环;同时,由基于激光的多光束光学传感器(MOS)系统监测原位应力行为。在900℃下进行900℃后,未覆盖的薄膜在室温下呈高残余应力和高温下的塑料行为,而覆盖的MO膜在室温和900°之间的热循环期间显示出几乎完全的弹性变形。 C几乎没有任何塑性变形,在等温退火过程中的恒定应力值没有值得注意的蠕变。此外,在热循环之后,MO膜没有以及覆盖层的电阻率低(≤10μΩ·cm)。

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