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首页> 美国卫生研究院文献>Materials >Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration
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Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration

机译：Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应

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摘要

The crystallographic characteristic effect of Cu substrate on cathode dissolution behavior in line-type Cu/Sn–3.0Ag–0.5Cu (SAC305)/Cu solder joints during electromigration (EM) was investigated by scanning electron microscope (SEM), electron backscatter diffraction (EBSD), and first-principles calculations. The SEM and EBSD results show that the crystallographic characteristic of Cu substrate is crucial to cathode dissolution behavior under a direct current of 1.5 × 104 A/cm2 at 125 °C ± 2 °C. When the (001) plane of copper grain adjacent to the Cu3Sn/Cu interface is perpendicular or nearly perpendicular to the current direction, local cathode dissolution tips are easily formed, whereas the (111) plane remains mostly undissolved, which finally leads to the inhomogeneous cathode serrated dissolution in the substrate. The first-principles calculation results reveal that the different surface energies and energy barriers of the different crystallographic planes of Cu grains in the substrate are responsible for the local cathode dissolution tips. Adjusting the copper grain in a substrate to a crystal plane or direction that is difficult to dissolve during EM is a promising method for improving the reliability of solder joints in the future.
机译：通过扫描电子显微镜（SEM）研究了Cu / Sn-3.0AG-0.5Cu（SAC305）/ Cu焊点中的阴极溶解行为对电扫描（SAC305）/ Cu焊点的晶体溶解行为的晶体特征效应（SEM），电子反向散射衍射（ EBSD）和第一原理计算。 SEM和EBSD结果表明，Cu衬底的晶体特性在125℃±2℃下在1.5×104a / cm 2的直流电流下对阴极溶解行为至关重要。当与Cu3Sn / Cu接口相邻的铜颗粒的（001）平面垂直或几乎垂直于电流方向时，容易形成局部阴极溶解尖端，而（111）平面仍然是未溶解的，这最终导致不均匀的阴极锯齿状溶解在基材中。第一原理计算结果表明，基板中Cu颗粒的不同晶粒的不同表面能和能量屏障是局部阴极溶解尖端的原因。将衬底中的铜颗粒调节到难以溶解期间难以溶解的晶面或方向，这是提高未来焊点可靠性的有希望的方法。

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