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Cu Cu Cu Cu Cu BALL Cu CORE BALL SOLDER JOINT SOLDER PASTE SOLDER FOAM AND METHOD FOR PRODUCING Cu BALL AND Cu CORE BALL
Cu Cu Cu Cu Cu BALL Cu CORE BALL SOLDER JOINT SOLDER PASTE SOLDER FOAM AND METHOD FOR PRODUCING Cu BALL AND Cu CORE BALL
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机译：铜铜铜铜铜球铜芯球焊接头糊锡膏泡沫及生产铜球和铜芯球的方法。
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摘要
Provided are Cu balls, Cu core balls, solder joints, solder pastes, and foam solders that are resistant to dropping impact and can suppress occurrence of poor bonding. The electronic component 60 is configured by joining the solder bumps 30 of the semiconductor chip 10 and the electrodes 41 of the printed circuit board 40 with the solder pastes 12, 42. The solder bumps 30 are formed by bonding the Cu balls 20 to the electrodes 11 of the semiconductor chip 10. The Cu ball | bowl 20 which concerns on this invention is 99.9% or more and 99.995% or less, the sphericity is 0.95 or more, and Vickers hardness is 20 HV or more and 60 HV or less.
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