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A Novel Conductive Core-Shell Particle Based on Liquid Metal for Fabricating Real-Time Self-Repairing Flexible Circuits

机译:一种基于液态金属的新型导电核-壳粒子,用于制备实时自修复柔性电路

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摘要

As a critical part of flexible electronics, flexible circuits inevitably work in a dynamic state, which causes electrical deterioration of brittle conductive materials (i.e., Cu, Ag, ITO). Recently, gallium-based liquid metal particles (LMPs) with electrical stability and self-repairing have been studied to replace brittle materials owing to their low modulus and excellent conductivity. However, LMP-coated Ga2O3 needs to activate by external sintering, which makes it more complicated to fabricate and gives it a larger short-circuit risk. Core-shell structural particles (Ag@LMPs) that exhibit excellent initial conductivity(8.0 omega sq(-1)) without extra sintering are successfully prepared by coating nanosilver on the surface of LMPs through in situ chemical reduction. The critical stress at which rigid Ag shells rupture can be controlled by adjusting the Ag shell thickness so that LM cores with low moduli can release, achieving real-time self-repairing (within 200 ms) under external destruction. Furthermore, a flexible circuit utilizing Ag@LMPs is fabricated by screen printing, and exhibits outstanding stability and durability (R/R-0 < 1.65 after 10 000 bending cycles in a radius of 0.5 mm) because of the functional core-shell structure. The self-repairable Ag@LMPs prepared in this study are a candidate filler for flexible circuit design through multiple processing methods.
机译:作为柔性电子设备的关键部分,柔性电路不可避免地在动态状态下工作,这会导致脆性导电材料(即Cu,Ag,ITO)的电性能下降。近来,由于其低模量和优异的导电性,已经研究了具有电稳定性和自修复的镓基液态金属颗粒(LMP)来代替脆性材料。然而,涂覆有LMP的Ga2O3需要通过外部烧结来活化,这使其制造起来更加复杂,并具有更大的短路风险。通过原位化学还原将纳米银涂覆在LMP的表面上,成功制备了具有优异初始电导率(8.0Ωsq(-1))且无需额外烧结的核壳结构颗粒(Ag @ LMP)。可以通过调节Ag壳的厚度来控制刚性Ag壳破裂的临界应力,以便释放低模量的LM核,从而在外部破坏下实现实时自我修复(200毫秒内)。此外,通过功能性的核壳结构,利用Ag @ LMPs的柔性电路通过丝网印刷制造,并且具有出色的稳定性和耐用性(10000次弯曲循环后在0.5 mm的半径内R / R-0 <1.65)。在这项研究中制备的可自我修复的Ag @ LMPs是通过多种处理方法进行灵活电路设计的候选填充物。

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