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首页> 外文期刊>Advanced Materials for Optics and Electronics >Laser-assisted Etching and Metallisation of Via-Holes in Polyethylene Terephthalate
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Laser-assisted Etching and Metallisation of Via-Holes in Polyethylene Terephthalate

机译：聚对苯二甲酸乙二醇酯中孔的激光辅助蚀刻和金属化

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摘要

Experimental results are presented on via-hole etching in a thick (100 μm) film of polyethylene terephthalate (PET) with the help of a copper vapour laser (wavelength λ = 510 nm, pulse duration 10 ns, repetition rate 8 kHz). The rate of via-hole formation is as high as 100 μm s~(-1). The effective coupling of the polymer film to the laser radiation is due to the formation of highly absorbing graphitised regions in the bulk of the film, which is initially transparent at the laser wavelength. The side walls of the hole can be metallised by simultaneous decomposition of a Pd(acac)_2 spun-on layer as a precursor for subsequent electroless Ni deposition. The activation of the inner surface of the hole is achieved as a result of the precursor vapour entering the hole during laser etching. The metallised via-hole provides a good electrical interconnection of the two sides of the PET film.
机译：借助铜蒸气激光器（波长λ= 510 nm，脉冲持续时间10 ns，重复频率8 kHz），在厚（100μm）的聚对苯二甲酸乙二醇酯（PET）膜上进行通孔蚀刻，给出了实验结果。通孔形成的速率高达100μms〜（-1）。聚合物膜与激光辐射的有效耦合是由于在膜的主体中形成了高度吸收的石墨化区域，该区域最初在激光波长下是透明的。孔的侧壁可以通过同时分解Pd（acac）_2旋涂层作为后续化学镀Ni沉积的前体来金属化。孔的内表面的激活是由于在激光蚀刻期间前驱物蒸气进入孔而导致的。金属化的通孔为PET膜的两侧提供了良好的电互连。

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