The Largest Conference Program for Microelectronics, Assembly, Reliability, Emerging Applications, Materials and Advanced Packaging in the Fall of 2017

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The Largest Conference Program for Microelectronics, Assembly, Reliability, Emerging Applications, Materials and Advanced Packaging in the Fall of 2017

机译：2017年秋季最大的微电子，组装，可靠性，新兴应用，材料和先进封装会议计划

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This year's attendees will find an IMAPS 2017 program with technical sessions balancing between emerging, new and mature topics, and a large cross-section of vendors exhibiting their products and technologies in the exhibition hall. The IMAPS committees and many dedicated volunteers have prepared the 2017 Symposium with an emphasis on exciting topics that are relevant within the microelectronics community with session topics on fan-out wafer level packaging; embedded packaging; heterogeneous & complex system packaging; advanced CMOS nodes; miniaturization of bio-devices; 3D technologies; wire bonding; additive manufacturing; materials; and much more.

机译：今年的与会者将发现一个IMAPS 2017计划，其中的技术会议将在新兴话题，新话题和成熟话题之间取得平衡，并且有大量供应商在展厅展示其产品和技术。 IMAPS委员会和许多敬业的志愿者准备了2017年研讨会，重点是与微电子领域相关的令人兴奋的主题，以及与扇出晶圆级封装有关的会议主题；嵌入式包装；异构和复杂的系统包装；先进的CMOS节点;生物设备的小型化； 3D技术；引线键合；添加剂制造;材料;以及更多。

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《Advancing Microelectronics》 |2017年第5期|30-30|共1页
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The Largest Conference Program for Microelectronics, Assembly, Reliability, Emerging Applications, Materials and Advanced Packaging in the Fall of 2017

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