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Analysis of micro-Raman spectra combined with electromagnetic simulation and stress simulation for local stress distribution in Si devices

机译:微拉曼光谱分析与电磁仿真和应力仿真相结合的硅器件局部应力分布

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摘要

We have developed a Raman simulation method using a finite-difference time-domain electromagnetic simulation and a finite element method stress simulation for precise local stress analysis of Si devices. This method accounts for the modification of light distribution by the sample structure, which significantly affects the Raman spectra near a metal gate structure with high refractive index and extinction coefficient. The precise stress estimation by this method is verified by analyzing polarized UV Raman measurements of a metal-oxide semiconductor field-effect transistor structure with a metal gate.
机译:我们已经开发了一种使用有限差分时域电磁仿真和有限元方法应力仿真的拉曼仿真方法,用于Si器件的精确局部应力分析。该方法说明了样品结构对光分布的修改,这极大地影响了具有高折射率和消光系数的金属栅极结构附近的拉曼光谱。通过分析带有金属栅极的金属氧化物半导体场效应晶体管结构的极化UV拉曼测量,可以验证通过这种方法进行的精确应力估算。

著录项

  • 来源
    《Applied Physics Letters》 |2012年第24期|243511.1-243511.4|共4页
  • 作者单位

    Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba, Ibaraki 305-8562, Japan;

    Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba, Ibaraki 305-8562, Japan;

    National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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