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首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Fabrication of submicron Nb/AlOx-Al/Nb tunnel junctions using focused ion beam implanted Nb patterning (FINP) technique
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Fabrication of submicron Nb/AlOx-Al/Nb tunnel junctions using focused ion beam implanted Nb patterning (FINP) technique

机译:使用聚焦离子束注入Nb图案化(FINP)技术制造亚微米Nb / AlOx-Al / Nb隧道结

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摘要

We have successfully fabricated 0.2 μm2 Nb/AlOx/Nb tunnel junctions using the focused-ion-beam implanted Nb patterning (FINP) technique for junction definition. The success was due to improvement of the edge profile of the counter electrode. The vertical edge profile was realized with the large etching selectivity of Ga implanted Nb over unimplanted Nb by controlling the reactive neutrals in the plasma. The critical current Ic and the quality parameter Vm of 0.2 μm2 junctions were 10.5 μA and 11 mV, respectively. The Rsg/Rn was 12. The maximum to minimum spread in Ic of 60 series junctions with areas of 0.5 μm2 was ±10%.
机译:我们已经使用聚焦离子束注入Nb图案化(FINP)技术成功制造了0.2μm2Nb / AlOx / Nb隧道结,以进行结点定义。成功的原因在于对电极边缘轮廓的改善。通过控制等离子体中的反应性中性离子,可以使Ga注入的Nb相对于未注入的Nb具有较大的蚀刻选择性,从而实现垂直边缘轮廓。临界电流Ic和0.2μm2结的质量参数Vm分别为10.5μA和11 mV。 Rsg / Rn为12。面积为0.5μm2的60个串联结的Ic的最大到最小扩展为±10%。

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