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Growth of Ag microanoparticles using stress migration from multilayered metallic structure

机译:利用从多层金属结构中的应力迁移来生长银微/纳米颗粒

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A multilayered metallic structure, consisting of Cu foil and subsequently deposited Ag thin film covered with a passivation layer, was proposed to fabricate Ag microanoparticles by stress migration. With employing a ductile Pt or brittle TiN thin film as passivation, Ag microanoparticles were successfully fabricated by annealing the corresponding multilayered structure. The relationship between characteristics (average diameter, number and volume) of the formed Ag microanoparticles and the annealing temperature was discussed. On this basis, the growth mechanism was developed, which indicates that the dimension of Ag particles was mainly dominated by the different pathways for the migration of diffused Ag atoms in the passivation layers of Pt and TiN and the annealing temperature. (C) 2015 Elsevier B.V. All rights reserved.
机译:提出了一种多层金属结构,该结构由Cu箔和随后沉积的覆盖有钝化层的Ag薄膜组成,可通过应力迁移来制造Ag微/纳米颗粒。通过使用可延展的Pt或脆性TiN薄膜作为钝化层,通过退火相应的多层结构成功地制造了Ag微/纳米颗粒。讨论了所形成的银微/纳米颗粒的特性(平均直径,数量和体积)与退火温度之间的关系。在此基础上发展了生长机理,表明Ag颗粒的尺寸主要受Pt和TiN钝化层中扩散的Ag原子迁移的不同途径和退火温度的影响。 (C)2015 Elsevier B.V.保留所有权利。

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