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首页> 外文期刊>Applied Surface Science >Molecular dynamics investigation of the effect of copper nanoparticle on the solid contact between friction surfaces
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Molecular dynamics investigation of the effect of copper nanoparticle on the solid contact between friction surfaces

机译：分子动力学研究铜纳米颗粒对摩擦表面之间固体接触的影响

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摘要

This study investigated the effect of copper (Cu) nanoparticles on the solid contact between friction surfaces by applying a molecular dynamics method to reveal the mechanisms responsible for the favorable friction properties of nanoparticles. Two models were built, which were named model A (without Cu) and model B (with Cu), respectively. The differences in the mechanical properties between these two models were compared. The simulation results demonstrated that the improvement in friction properties by Cu nanoparticles was more obvious at low velocity than at high velocity. At low velocity, a Cu nano-film was formed on the friction surface, which accommodated the velocity gradient and plastic deformation. Due to the good lubrication effect of the nano-film, the plastic deformation, defect structures and friction force of model B were improved compared with model A. Under high velocity conditions, a transfer layer appeared adjacent to the interface in both models. Because of this, the friction forces of the two models decreased with increased velocity. The fluid mechanics theory was used to explain why the friction force in model B was lower than that in model A at high velocity. The effect of the load on friction properties was also analyzed and the results showed that the mechanisms of anti-wear and friction reduction by Cu nanoparticles under a low load were the same as those under a high load.
机译：这项研究通过应用分子动力学方法研究了铜（Cu）纳米颗粒对摩擦表面之间的固体接触的影响，以揭示造成纳米颗粒良好摩擦性能的机理。建立了两个模型，分别命名为模型A（无Cu）和模型B（有Cu）。比较了这两个模型之间的机械性能差异。仿真结果表明，铜纳米颗粒在低速下的摩擦性能改善比在高速下更明显。在低速下，在摩擦表面上形成了一层铜纳米薄膜，该薄膜适应了速度梯度和塑性变形。由于纳米膜的良好润滑效果，与模型A相比，模型B的塑性变形，缺陷结构和摩擦力得到了改善。在高速条件下，两个模型中的界面附近都出现了转移层。因此，两个模型的摩擦力随速度的增加而减小。流体力学理论被用来解释为什么在高速时模型B中的摩擦力低于模型A中的摩擦力。分析了负载对摩擦性能的影响，结果表明，铜纳米颗粒在低负载下的抗磨减摩机理与高负载下的相同。

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  • 来源
    《Applied Surface Science》 |2014年第1期|302-309|共8页
  • 作者

    Chengzhi Hu; Minli Bai; Jizu Lv; Hao Liu; Xiaojie Li;

  • 作者单位

    School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China;

    School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China;

    School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China;

    School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China;

    The State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Copper nanoparticle; Molecular dynamics; Friction properties; Nano-film; Transfer layer;

    机译：铜纳米粒子;分子动力学;摩擦性能;纳米膜转移层;

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