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首页> 外文期刊>Applied Surface Science >Surface rejuvenation for multilayer metal deposition on polymer microspheres via self-seeded electroless plating
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Surface rejuvenation for multilayer metal deposition on polymer microspheres via self-seeded electroless plating

机译：通过自种化学镀在聚合物微球上进行多层金属沉积的表面修复

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摘要

A surface rejuvenation process was developed for generation variable thickness of metal deposits on polymer microspheres via electroless plating. Thus, Ni(Ⅱ), Cu(Ⅱ) and Ag(Ⅰ) complexes formed on tri-ethylenetetramine (TETA) functional crosslinked poly(glycidyl methacrylate) (PGMA) microspheres were reduced to zero-valent metals. The resulting metals (1.1-1.5 mmol g~(-1)) were employed as seed points for electroless metal plating (self-seeding) without using Pd or tin pre-activating species. Treatment of the metalized surfaces with hydrazine or hydrazinium formate was demonstrated to reactivate (rejuvenate) the surface and allows further metal deposition from electroless plating solutions. Followed repeating of the surface rejuvenation-metalization steps resulted in step wise increasing of the metal deposits (90-290 mg per g in each cycle), as inferred from metal analyses, ESEM and XPS analysis. Experiments showed that, after 6 times of cycling the metal deposits exceed 1 g per g of the microspheres on average. The process seemed to be promising for tuning up of the metal thickness by stepwise electroless plating.
机译：开发了一种表面活化工艺，用于通过化学镀在聚合物微球上产生厚度可变的金属沉积物。因此，在三亚乙基四胺（TETA）功能交联的聚甲基丙烯酸缩水甘油酯（PGMA）微球上形成的Ni（Ⅱ），Cu（Ⅱ）和Ag（Ⅰ）络合物被还原为零价金属。所得金属（1.1-1.5 mmol g〜（-1））用作化学镀（自种）的种子点，而无需使用Pd或锡预活化物质。已证明用肼或甲酸肼处理金属化表面可以使表面重新活化（恢复活力），并允许从化学镀液中进一步沉积金属。从金属分析，ESEM和XPS分析推断，随后重复进行表面活化金属化步骤，导致金属沉积物逐步增加（每个循环90-290 mg / g）。实验表明，经过6次循环后，金属沉积物平均每克微球超过1克。该工艺似乎有望通过逐步化学镀来调整金属厚度。

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