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Investigation of thermally grown oxide on 4H-SiC by a combination of H_2O and HNO_3 vapor with varied HNO_3 solution heating temperature

机译:H_2O和HNO_3蒸气在不同HNO_3溶液加热温度下的组合研究4H-SiC上热生长氧化物

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摘要

A new technique of oxidizing n-type 4H-SiC in a combination of H_2O and nitric acid (HNO_3) vapor at various heating temperatures (60 ℃, 70 ℃, 80 ℃, 90℃, 100℃ and 110℃) of HNO_3 solution has been introduced in this work. Utilizing secondary ion mass spectroscopy, effects of H~+ and N~- on the passivation of structural defects at the bulk oxide and partial of the SiC/SiO_2 interface have been discussed. The effects of heating temperature of HNO_3 solution on structural properties of the SiC substrate; after the oxide has been removed have been systematically investigated. Contact angles and the surface roughness of the substrate were recorded from a Goniometer and an atomic force microscope, respectively. It has been revealed that as compared to oxide grown by conventional wet (H_2O vapor only) oxidation technique; this "wet diluted nitridation" technique is able to produce oxide with lower interface-state density and higher breakdown voltage. Physical properties of the substrate after oxide removal show surface roughness reduces as the heating temperature of HNO_3 solution increases, which is mainly attributed by the significant reduction of carbon content at the SiC/SiO_2 interface.
机译:在HNO_3溶液的各种加热温度(60℃,70℃,80℃,90℃,100℃和110℃)下,将H_2O和硝酸(HNO_3)蒸汽结合而氧化n型4H-SiC的新技术在这项工作中进行了介绍。利用二次离子质谱,讨论了H〜+和N〜-对本体氧化物和部分SiC / SiO_2界面处结构缺陷钝化的影响。 HNO_3溶液的加热温度对SiC衬底结构性能的影响;去除氧化物后,已经进行了系统的研究。分别从测角计和原子力显微镜记录基板的接触角和表面粗糙度。已经发现,与通过常规湿式(仅H_2O蒸气)氧化技术生长的氧化物相比;这种“湿式稀释氮化”技术能够生产出具有较低界面态密度和较高击穿电压的氧化物。 HNO_3溶液加热温度升高后,去除氧化物后的基板物理性能显示出表面粗糙度降低,这主要归因于SiC / SiO_2界面处碳含量的显着降低。

著录项

  • 来源
    《Applied Surface Science》 |2013年第ptab期|795-804|共10页
  • 作者单位

    Electronic Materials Research Group, School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia;

    Power Semiconductor Research Centre, Korea Electrotechnology Research Institute, P.O. Box 20, Changwon, Gyungnam 641-120, South Korea;

    Power Semiconductor Research Centre, Korea Electrotechnology Research Institute, P.O. Box 20, Changwon, Gyungnam 641-120, South Korea;

    Power Semiconductor Research Centre, Korea Electrotechnology Research Institute, P.O. Box 20, Changwon, Gyungnam 641-120, South Korea;

    Power Semiconductor Research Centre, Korea Electrotechnology Research Institute, P.O. Box 20, Changwon, Gyungnam 641-120, South Korea;

    Power Semiconductor Research Centre, Korea Electrotechnology Research Institute, P.O. Box 20, Changwon, Gyungnam 641-120, South Korea;

    Power Semiconductor Research Centre, Korea Electrotechnology Research Institute, P.O. Box 20, Changwon, Gyungnam 641-120, South Korea;

    Electronic Materials Research Group, School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Perai Selatan, Penang, Malaysia;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Silicon carbide; Silicon dioxide; Wet nitridation; HNO_3 vapor;

    机译:碳化硅;二氧化硅;湿氮化HNO_3蒸气;

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