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Annealing Effects On The Plasmonic Excitations Of Metal/metal Interfaces

机译:退火对金属/金属界面的等离子体激元激发的影响

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The effects of the annealing procedure at 400-450 K on the electronic properties of nanoscale thin films of Ca, Au and Ag grown on Cu(1 1 1) at room temperature were probed by high-resolution electron energy loss spectroscopy measurements. Ca surface plasmon underwent to a significant red-shift upon annealing, due to the oxidation of the topmost Ca layer. Water strongly interacted with the CaO interface at room temperature. Au surface plasmon disappeared upon annealing the gold film, as a consequence of the formation of an Au-Cu alloy. Ag surface plasmon red-shifted both in the annealed adlayer and with increasing temperature compared with the frequency recorded for the as-deposited silver film.
机译:通过高分辨率电子能量损失谱法测量,研究了在400-450 K的退火程序对室温下在Cu(1 1 1)上生长的Ca,Au和Ag纳米级薄膜的电子性能的影响。由于最顶层Ca层的氧化,Ca表面等离子体激元在退火后经历了明显的红移。在室温下,水与CaO界面强烈相互作用。由于金-铜合金的形成,金膜退火后金表面等离子体激元消失。与在沉积的银膜中记录的频率相比,在退火的夹层中和随着温度升高,Ag表面等离子体激元都发生了红移。

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