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Silicidation in Ni/Si thin film system investigated by X-ray diffraction and Auger electron spectroscopy

机译:X射线衍射和俄歇电子能谱研究Ni / Si薄膜体系中的硅化

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Silicide formation induced by thermal annealing in Ni/Si thin film system has been investigated using glancing incidence X-ray diffraction (GIXRD) and Auger electron spectroscopy (AES). Silicide formation takes place at 870 K with Ni_2Si, NiSi and NiSi_2 phases co-existing with Ni. Complete conversion of intermediate silicide phases to the final NiSi_2 phase takes place at 1170 K. Atomic force microscopy measurements have revealed the coalescence of pillar-like structures to ridge-like structures upon silicidation. A comparison of the experimental results in terms of the evolution of various silicide phases is presented.
机译:使用掠入射X射线衍射(GIXRD)和俄歇电子能谱(AES)研究了在Ni / Si薄膜系统中由热退火引起的硅化物形成。硅化物的形成在870 K处发生,其中Ni_2Si,NiSi和NiSi_2相与Ni共存。中间硅化物相向最终NiSi_2相的完全转化发生在1170K。原子力显微镜测量显示,硅化后,柱状结构聚结为脊状结构。提出了根据各种硅化物相的演变对实验结果的比较。

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