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首页> 外文期刊>Applied Surface Science >Surface morphology of metal films deposited on mica at various temperatures observed by atomic force microscopy
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Surface morphology of metal films deposited on mica at various temperatures observed by atomic force microscopy

机译：通过原子力显微镜观察在不同温度下沉积在云母上的金属膜的表面形态

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Thin films of eight metals with a thickness of 150 mn were deposited on mica substrates by thermal evaporation at various temperatures in a high vacuum. The surface morphology of the metal films was observed by atomic force microscopy (AFM) and the images were characterized quantitatively by a roughness analysis and a bearing analysis (surface height analysis). The films of Au, Ag, Cu, and Al with the high melting points were prepared at homologous temperatures T/T-m, = 0.22-0.32, 0.40, and 0.56. The films of In, Sn, Bi, and Pb with the low melting points were prepared at T/T-m, = 0.55-0.70, where T and T-m are the absolute temperatures of the mica substrate and the melting point of the metal, respectively. The surface morphology of these metal films was studied based on a structure zone model. The film surfaces of Au, Ag, and Cu prepared at the low temperatures (T/T-m = 0.22-0.24) consist of small round grains with diameters of 30-60 nm and heights of 2-7 nm. The surface heights of these metal films distribute randomly around the surface height at 0 nm and the morphology is caused by self-shadowing during the deposition. The grain size becomes large due to surface diffusion of adatoms and the film surfaces have individual characteristic morphology and roughnesses as T increases. The surface of the Al film becomes very smooth as T increases and the atomically smooth surface is obtained at T/T-m = 0.56-0.67 (250-350 degrees C). On the other hand, the atomically smooth surface of the An film is obtained at T/T-m = 0.56 (473 3 degrees C). The films of In, Sn, Bi, and Pb prepared at T/T-m = 0.55-0.70 also show the individual characteristic surface morphology. (c) 2005 Elsevier B.V. All rights reserved.
机译：通过在高真空下于各种温度下进行热蒸发，将厚度为1.5亿的八种金属薄膜沉积在云母基板上。通过原子力显微镜（AFM）观察金属膜的表面形态，并通过粗糙度分析和方位分析（表面高度分析）对图像进行定量表征。在相同的温度T / T-m ＝ 0.22-0.32、0.40和0.56下制备具有高熔点的Au，Ag，Cu和Al的膜。在T / T-m = 0.55-0.70处制备低熔点的In，Sn，Bi和Pb薄膜，其中T和T-m分别是云母基底的绝对温度和金属的熔点。基于结构区模型研究了这些金属膜的表面形态。在低温（T / T-m = 0.22-0.24）下制备的Au，Ag和Cu的膜表面由直径为30-60 nm，高度为2-7 nm的小圆形晶粒组成。这些金属膜的表面高度在0nm处围绕表面高度随机分布，并且形态是由沉积期间的自遮蔽引起的。晶粒尺寸由于吸附原子的表面扩散而变大，并且随着T的增加，膜表面具有独特的特征形态和粗糙度。随着T的增加，Al膜的表面变得非常光滑，并且在T / T-m ＝ 0.56-0.67（250-350℃）下获得原子上光滑的表面。另一方面，在T / T-m ＝ 0.56（473 3℃）下获得An膜的原子光滑表面。在T / T-m = 0.55-0.70制备的In，Sn，Bi和Pb膜也显示出各自的特征表面形态。 （c）2005 Elsevier B.V.保留所有权利。

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