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首页> 外文期刊>Arabian Journal for Science and Engineering >Cooling Computer Chips with Cascaded and Non-cascaded Thermoelectric Devices
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Cooling Computer Chips with Cascaded and Non-cascaded Thermoelectric Devices

机译：用级联和非级联热电设备冷却计算机芯片

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Thermoelectric devices are currently being used in cooling and generating electricity applications. This study mainly focuses on using thermoelectric devices for both applications towards cooling down computer chips; especially, that the very large scale integration technology has reached high advancement where more than 100 million transistors can be fabricated in 1 mm(2). Reducing the non-uniformity of the chip temperature is important so as to decrease the induced thermal stress in this chip and consequently reduce its failure rate. To simultaneously reduce both the non-uniformity of the temperature distribution in the chip and the power requirements for the cooling system, thermoelectric generators can be installed on the cooler chip areas to harvest electrical power from the chip wasted heat. Thereafter, the chip hotspot areas are cooled down using thermoelectric coolers that are powered by the harvested electrical power from the thermoelectric generators in order to maintain the temperatures of these hotspots to be less than or equal a certain temperature threshold. Because no additional electrical power requirement is needed to cool down the hotspots, this cooling technique is called in this paper as "sustainable self-cooling framework for cooling chip hotspots". However, the question is that can the harvested electrical power by the thermoelectric generators be enough to power the thermoelectric coolers for different computer chips at a given operating condition? As such, one of the objectives of this paper is to develop a three-dimensional numerical and optimization model to predict the thermal and electrical performance of cascaded and non-cascaded thermoelectric generators and cascaded and non-cascaded thermoelectric coolers for cooling chip applications. Then, validate the developed model against experimental data. The results showed that the predictions of the developed model were in good agreement with the experimental to within +/- 4%. After gaining confidence in the developed model, it was used for a given chip operating condition to conduct a case study for a sustainable self-cooling framework in order to answer the raised question above. The results showed that the self-cooling framework can successfully cool down the hotspot at an acceptable temperature with not only no need for additional electrical power requirements but also for reducing the non-uniformity in the chip temperature distribution.
机译：当前，热电装置被用于冷却和发电应用。这项研究主要侧重于将热电设备用于这两种应用，以降低计算机芯片的温度。特别是超大规模集成技术已经取得了很大的进步，在1毫米（2）中可以制造超过1亿个晶体管。减小芯片温度的不均匀性很重要，以减小该芯片中的感应热应力，从而降低其故障率。为了同时减少芯片中温度分布的不均匀性和冷却系统的功率需求，可以在较冷的芯片区域上安装热电发生器，以从芯片浪费的热量中收集电能。此后，使用热电冷却器冷却芯片热点区域，该热电冷却器由来自热电发生器的收集的电能提供动力，以将这些热点的温度保持为小于或等于某个温度阈值。由于不需要额外的电力来冷却热点，因此本文将这种冷却技术称为“用于冷却芯片热点的可持续自冷却框架”。但是，问题在于，在给定的工作条件下，热电发电机收集的电能是否足以为不同计算机芯片的热电冷却器供电？因此，本文的目标之一是建立一个三维数值和优化模型，以预测级联和非级联热电发电机以及级联和非级联热电冷却器在冷却芯片应用中的热和电性能。然后，对照实验数据验证开发的模型。结果表明，所开发模型的预测与实验结果吻合良好，误差在+/- 4％以内。在对开发的模型充满信心之后，将其用于给定的芯片工作条件，以对可持续的自冷却框架进行案例研究，以回答上述提出的问题。结果表明，自冷却框架可以在可接受的温度下成功地冷却热点，不仅不需要额外的电功率要求，而且还可以减少芯片温度分布中的不均匀性。

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