• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Arabian Journal for Science and Engineering >Header Design Optimization of Mini-channel Heat Sinks Using CuO–H_2O andAl_2O_3–H_2O Nanofluids for Thermal Management
【24h】

Header Design Optimization of Mini-channel Heat Sinks Using CuO–H_2O andAl_2O_3–H_2O Nanofluids for Thermal Management

机译：使用CuO–H_2O和Al_2O_3–H_2O纳米流体进行热管理的微通道散热器的接头设计优化

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Heat sinks are used in thermal management of the electronic devices such as supercomputers, data centres and batteries and fuel cells. Particularly, cooling requirements of microprocessors increase due to an increase in miniaturization and computational requirements. Efficient working of heat sinks is important to maintain certain temperature by dissipating heat to the environment. Development of efficient heat transfer mechanism is dependent on the highly conductive working fluids and heat transfer surfaces with high heat transfer coefficients. In the present investigation, four different geometries and three working fluids have been investigated to optimize the heat dissipation rate. In the present research, the thermal and hydraulic performance of heat sinks has been investigated. Experiments and numerical simulations have been conducted at different flow rates for different designs of heat sinks using water and CuO-, Al2O3-based nanofluids. Volume concentrations of 0.67% and 0.4% were used for Al2O3-H2O and CuO-H2O nanofluids, respectively, and 2.5 g each of aluminium and copper oxides nanoparticles were used. The simulated base temperature was 110 degrees C through mice element for the experimentation. Optimized configuration of the heat sink was obtained using water, and experiments were performed to examine the heat transfer enhancement using water and nanofluids. The main purpose of this investigation is to minimize the base temperature of the heat sink and to increase the heat transfer rate. The minimum base temperatures obtained for Al2O3-H2O nanofluids and water were 43.4 degrees C and 45.2 degrees C, respectively, on the mini-channel heat sink with 0.5 mm fin spacing.
机译：散热器用于电子设备（如超级计算机，数据中心以及电池和燃料电池）的热管理。特别地，由于小型化和计算需求的增加，微处理器的冷却需求增加。散热器的有效工作对于通过将热量散发到环境中来维持一定的温度非常重要。高效传热机制的发展取决于高导热的工作流体和具有高传热系数的传热表面。在本研究中，已经研究了四种不同的几何形状和三种工作流体以优化散热率。在本研究中，已经研究了散热器的热力和水力性能。对于使用水和基于CuO-，Al2O3的纳米流体的不同设计的散热器，已经在不同的流量下进行了实验和数值模拟。 Al2O3-H2O和CuO-H2O纳米流体的体积浓度分别为0.67％和0.4％，并且分别使用2.5 g的铝和氧化铜纳米颗粒。对于实验，通过小鼠元件模拟的基础温度为110摄氏度。使用水获得散热器的最佳配置，并进行了实验以检查使用水和纳米流体的传热效果。该研究的主要目的是最小化散热器的基本温度并提高传热速率。在翅片间距为0.5 mm的微型通道散热器上，Al2O3-H2O纳米流体和水获得的最低基本温度分别为43.4摄氏度和45.2摄氏度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号