• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Circuits and systems >Augmenting the Heat Sink for Better Heat Dissipation
【24h】

Augmenting the Heat Sink for Better Heat Dissipation

机译：增强散热器以更好地散热

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Heat sinks were invented to absorb heat from an electronic circuit conduct, and then to dissipate or radiate this heat to the surrounding supposedly, ventilated space, at a rate equal to or faster than that of its buildup. Ventilation was not initially recognized as an essential factor to thermal dispersion. However, as electronic circuit-boards continued to heat up, circuit failure became a problem, forcing the inclusion of miniaturized high speed fans. Later, heat sinks with fins and quiet fans were incorporated in most manufactured circuits. Now heat sinks come in the form of a fan with fans made to function as fins to disperse heat Heat sinks absorb and radiate excess heat from circuit-boards in order to prolong the circuit's life span. The higher the thermal conductivity of the material used the more efficient and effective the heat sink is. This paper is an attempt to theoretically design a heat sink with a temperature gradient lower than that of the circuit board's excess heat.
机译：发明了散热片以吸收来自电子线路的热量，然后以等于或快于其堆积的速率将这种热量散发或散发到周围的通风空间。最初，通风并不是散热的必要因素。但是，随着电子电路板的持续升温，电路故障成为一个问题，迫使包括小型化的高速风扇。后来，在大多数制造的电路中都集成了带有散热片和静音风扇的散热器。现在，散热器以风扇的形式出现，其中的风扇用作散热片，以散发热量。散热器吸收并散发电路板上的多余热量，以延长电路的使用寿命。所用材料的导热系数越高，散热器的效率和有效性就越高。本文是从理论上尝试设计温度梯度低于电路板多余热量的散热器的尝试。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号