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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >Thermal Conductivity Enhancement of Epoxy Composites by Interfacial Covalent Bonding for Underfill and Thermal Interfacial Materials in Cu/Low-K Application
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Thermal Conductivity Enhancement of Epoxy Composites by Interfacial Covalent Bonding for Underfill and Thermal Interfacial Materials in Cu/Low-K Application

机译：Cu / Low-K应用中底部填料和热界面材料的界面共价键增强环氧树脂复合材料的导热性

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摘要

Nowadays with enhanced performance and reduced profile, electronics and photonics devices demand efficient heat dissipation and low operation temperature. Thereby, instead of traditional fillers (e.g., fused silica), thermally conductive silicon carbide (SiC) particles and multiwall carbon nanotubes (MWNTs) are applied here as fillers in composites for underfill and thermal interfacial materials (TIMs), respectively. SiC particles are coated with an ultrathin layer of silicon oxide by thermal oxidation at 800$^{circ}{rm C}$ in air and consequently functionalized by $gamma$-glycidoxypropyl-trimethoxysilane in order to graft epoxides on their surface. Moreover, MWNTs were chemically functionalized with carboxyls and hydroxyls in a concentrated acid mixture. Transmission electron microscopy, Fourier-transform infrared spectrascopy, and thermogravimetric analysis characterization indicates that both of the fillers are successfully functionalized, which makes their surface reactive with epoxy resin, resulting in interfacial covalent chemical bonding between the thermally conductive fillers and epoxy resin. It is found that interfacial chemical bonding across the interface between these functionalized fillers and polymer matrix can promote significant thermal conductivity enhancement of epoxy composites, which is promising for underfill and TIMs in Cu/low-K application.
机译：如今，随着性能的增强和外形的减小，电子和光子器件要求高效的散热和较低的工作温度。因此，代替传统的填料（例如，熔融二氧化硅），导热碳化硅（SiC）颗粒和多壁碳纳米管（MWNT）在这里分别用作底部填充材料和热界面材料（TIM）的复合材料中的填料。 SiC颗粒通过在空气中800℃的热氧化作用而被涂有一层超薄的氧化硅，然后被γ-环氧丙氧基丙基-三甲氧基硅烷官能化，以便在其表面接枝环氧化合物。此外，MWNT在浓酸混合物中被羧基和羟基化学官能化。透射电子显微镜，傅立叶变换红外光谱和热重分析表征表明，两种填料均已成功官能化，这使它们的表面与环氧树脂发生反应，从而导致导热填料和环氧树脂之间发生界面共价化学键合。发现在这些功能化填料和聚合物基体之间的界面上进行界面化学键合可促进环氧复合材料的显着导热性增强，这对于铜/低K应用中的底部填充和TIMs很有希望。

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