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首页> 外文期刊>International Journal of Heat and Mass Transfer >Electroless deposition surface engineering of boron nitride sheets for enhanced thermal conductivity and decreased interfacial thermal resistance of epoxy composites
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Electroless deposition surface engineering of boron nitride sheets for enhanced thermal conductivity and decreased interfacial thermal resistance of epoxy composites

机译：氮化硼片的无电沉积表面工程，具有增强的导热率和环氧复合材料的界面热阻降低

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摘要

Filler surface engineering has become an effective method to improve the thermal conduction performance of polymeric composites. However, most of the surface engineering deposits low thermal conductivity materials on the surface of fillers. The increased interfacial thermal resistance between the functional filler will deteriorate the heat transfer capability of thermal conduction network. In order to construct an excellent thermal conduction network, the electroless deposition surface engineering was successfully designed to decorate the surface of BN sheet with high thermal conductivity metallic copper nanoparticles. Through the full characterization of the BN@CuNP and its epoxy-based composites, the effects of electroless deposition surface engineering on thermal conduction enhancement were investigated. The copper nanoparticles deposited on the surface of BN sheets will make the BN@CuNP fillers possess high thermal conductivity and effectively bridge the BN sheets, thereby exhibiting a synergistic effect in reducing the interfacial thermal resistance and enhancing the heat transfer capability of the BN@CuNP thermal conduction network. With the increase of filler content, the effects of electroless deposition surface engineering on thermal conduction enhancement are continuously promoted. The electroless deposition surface engineering shows great advantages in high thermal conductive composites design and fabrication.
机译：填充表面工程已成为提高聚合物复合材料的热传导性能的有效方法。然而，大多数表面工程在填料表面上沉积低导热率材料。功能填料之间的界面热阻增加将劣化热传导网络的传热能力。为了构建出优异的热传导网络，成功设计用于装饰高热导率金属铜纳米粒子的BN片材的表面。通过全部表征BN @ CUNP及其环氧基复合材料，研究了无电沉积表面工程对热传导增强的影响。沉积在BN片材表面上的铜纳米颗粒将使BN @ CUNP填料具有高导热率并有效地桥接BN片，从而在降低界面热阻和增强BN @ CUNP的传热能力方面表现出协同效应。热传导网络。随着填料含量的增加，连续促进了无电沉积表面工程对热传导增强的影响。化学沉积表面工程在高导热复合材料设计和制造中显示出很大的优势。

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