Challenges in Modification of Electronic Components

Winslow R.T.

首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Challenges in Modification of Electronic Components

【24h】

Challenges in Modification of Electronic Components

机译：电子元器件改造面临的挑战

获取原文

获取原文并翻译 | 示例

获取外文期刊封面封底 >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

Due to the surge in commercial applications, the semiconductor industry is literally brushing off their low-volume customers, including the military and aerospace industry. Recent conversions of components to pure tin (Sn) and other Pb-free finishes and materials have dramatically increased the complexity for these specialized modification services. These increased complexities in hot solder dip (HSD) and ball grid array (BGA) reballing are discussed in this open forum article. The author addresses the driving forces and why it is necessary to modify some commercial-off-the-shelf (COTS) components. Then he presents two specific component level modifications with some details: HSD and BGA reballing. With each of the conversions, some of the complexities faced by service providers are presented. Some suggestions on navigating the quagmire of new package designs and material changes being thrust upon the military and aerospace community are also discussed. Finally, the author concludes with some suggestions on how the industry can deal with these complexities and move carefully forward

机译：由于商业应用的激增，半导体行业从字面上掠夺了包括军事和航空航天行业在内的小批量客户。最近，将组件转换为纯锡（Sn）以及其他无铅饰面和材料的过程，极大地增加了这些专业修饰服务的复杂性。在此开放论坛文章中讨论了热浸焊（HSD）和球栅阵列（BGA）压焊中这些增加的复杂性。作者阐述了驱动力以及为什么有必要修改一些现成的商业（COTS）组件。然后，他提出了两个特定的组件级修改，其中包含一些细节：HSD和BGA压焊。每次转换都会显示服务提供商面临的一些复杂性。还讨论了一些有关解决新包装设计难题和对军事和航空航天领域进行材料变更的建议。最后，作者最后提出了有关该行业如何应对这些复杂性并谨慎前进的一些建议

著录项

来源
《IEEE Transactions on Components and Packaging Technologies》 |2007年第2期|p.356-358|共3页
作者
Winslow R.T.;
展开▼
作者单位

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类电子元件、组件;
关键词
ball grid arrays; electronic equipment manufacture; electronics industry; electronics packaging; soldering; BGA; COTS; GEIA; Government Electronics and Information Technology Association; HSD; ball grid array reballing; commercial-off-the-shelf components; electroni;

机译：球栅阵列;电子设备制造;电子工业;电子包装;焊接;BGA;COTS;GEIA;政府电子和信息技术协会;HSD;球栅阵列重排;现成的组件;电子;

相似文献

外文文献
中文文献
专利

1. ELECTRONIC COMPONENTS: MEETING THE CHALLENGES OF MILITARY EQUIPMENT [J] . Mark Jeffrey Design Solutions . 2020,第Sepa期

机译：电子元件：满足军事装备的挑战
2. Electronic Component Firms Deal with Challenges to Assure Growth [J] . Asia electronics industry . 2017,第2期

机译：电子元件公司应对挑战以确保增长
3. Challenges in the Qualification of Electronic Components and Systems [J] . Challa V., Rundle P., Pecht M. Device and Materials Reliability, IEEE Transactions on . 2013,第1期

机译：电子元器件和系统认证中的挑战
4. Challenges and Approaches to Radiation Hardness Control of Electronic Components to In-Space High-Energy Particles Exposure [C] . Vasily Anashin, Pavel Chubunov, Aleksandr Koziukov, International Symposium on High-Current Electronics . 2018

机译：电子组件对空间高能粒子暴露的辐射硬度控制的挑战和方法
5. Studies on multicomponent reactions: New 4- and 5-component routes to aminoacid diamides and 3-component routes to substituted indoles by modification of the classical Ugi and Fischer indole reactions. [D] . Simoneau, Christopher Allen. 2007

机译：多组分反应的研究：通过改良经典的Ugi和Fischer吲哚反应，新的4和5组分途径可生成氨基酸二酰胺，而3组分途径可生成取代的吲哚。
6. Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns [O] . Tomoya Koshi, Ken-ichi Nomura, Manabu Yoshida 2020

机译：耐用电子纺织品的电子元件安装：将元件直接焊接到基于纺织品的深渗透导电图案上
7. This study aims at examining the effects of electronic banking on banks profitability in Jordan. How banking sector finds itself before a new fact imposed by technology revolution and digits to change their work mechanisms from traditional means to electronic means and the challenges banks face as a result. Furthermore, this study investigates the reasons behinds providing electronic banking services through internet, their impact on banking services in general and banks profitability in particular. Risks and challenges involved are discussed Results and recommendations are included. Results revealed that electronic banking service has a negative effect on banks profitability on the short term. The importance of this study and the factors that make it unique is that, it discusses solely the topic of the effects of electronic banking on banks profitability, while most of other studies discuss the topic in general term. The findings of the study are the impact of electronic banking on banks profitability will be feature of the short run due to the capital investment by the banks on infrastructure and training but will be positive on the long run. [O] . Ahmad Z. Siam 2006

机译：这项研究旨在研究电子银行业务对约旦银行盈利能力的影响。在技术革命和数字技术将新的工作机制从传统手段转变为电子手段以及银行面临的挑战之前，银行业如何发现自己。此外，本研究调查了通过互联网提供电子银行服务背后的原因，它们对总体银行服务的影响，尤其是对银行盈利能力的影响。讨论了涉及的风险和挑战包括结果和建议。结果显示，电子银行服务在短期内对银行的盈利能力有负面影响。这项研究及其独特性的重要性在于，它仅讨论电子银行业务对银行盈利能力的影响这一主题，而其他大多数研究则从总体上讨论该主题。该研究的结果是，由于银行对基础设施和培训的资本投资，电子银行对银行盈利能力的影响将是短期的特征，但从长远来看将是积极的。

Challenges in Modification of Electronic Components

摘要

著录项

相似文献

相关主题

期刊订阅