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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Laser Drilling of Copper Foils for Electronics Applications
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Laser Drilling of Copper Foils for Electronics Applications

机译：用于电子应用的铜箔的激光钻孔

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摘要

Single pulse drilling of copper foils and copper-coated dielectric circuit board materials, relevant to applications in micro-electronics packaging, has been investigated here using an enhanced peak power CO 2-laser. The plasma generated during copper laser ablation, under these conditions, has been found to be self-extinguishing once the copper has been punched through, and does not materially impact the process. The analysis of the undercut formation in the copper coated laminates illustrated a direct link with the energy delivered to the dielectric after the copper has been laser ablated. Holes with zero undercut were obtained by the use of an acousto-optic modulator, used as a pulse shutter, to control the energy delivered to the dielectric. For unmodulated laser pulses, holes with zero undercut were obtained when drilling copper foils 35-mum thick. In general, when drilling copper-coated dielectrics with unmodulated pulses, holes with low undercut were obtained for peak powers <1.2 kW. However, the stochastic nature of copper drilling dominates the process in this regime. At higher peak powers (up to 1.8kW), a yield of 100% holes in copper is obtained, but this also results in significant undercut
机译：本文使用增强的峰值功率CO 2激光器研究了与微电子封装中的应用有关的铜箔和覆铜电介质电路板材料的单脉冲钻削。在这些条件下，一旦在铜上打孔，则在铜激光烧蚀过程中产生的等离子体会自动熄灭，不会对工艺产生实质性影响。对镀铜层压板中底切形成的分析表明，与激光烧蚀铜后传递到电介质的能量有直接联系。底切零的孔是通过使用声光调制器（用作脉冲快门）来控制传递到电介质的能量的。对于未调制的激光脉冲，在钻孔35毫米厚的铜箔时会获得底切为零的孔。通常，当以未调制的脉冲钻孔镀铜电介质时，对于峰值功率<1.2 kW，可获得具有低底切的孔。但是，在这种情况下，铜钻孔的随机性主导了整个过程。在更高的峰值功率（高达1.8kW）下，可获得100％的铜孔产率，但这也会导致明显的底切

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