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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change
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Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change

机译：MEMS陀螺仪传感器封装在温度变化下的变形行为

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摘要

In microelectromechanical system (MEMS) devices, the deformation of MEMS structure caused by packaging induced stress is of great concern since it directly affects the performance of the device. In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moire interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Analysis of the package reveals that global bending deformation occurs due to the mismatch of the coefficient of thermal expansion between the chip, the molding compound, and the printed circuit board. Detailed global and local deformations of the package by temperature change are investigated, and their effect on the frequency shift of the MEMS gyroscope is studied. It is found that package deformation or package induced stress results in the frequency shift of the MEMS gyroscope structure. In order to increase robustness of the structure against deformation, a "crab-leg" type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. This frequency shift is within the tolerance limit of the gyroscope sensor in this work
机译：在微机电系统（MEMS）器件中，由封装引起的应力引起的MEMS结构变形非常受关注，因为它直接影响器件的性能。在本文中，使用高灵敏度的莫尔干涉仪研究了MEMS陀螺仪封装在温度变化下的变形行为。提出了温度依赖的包装翘曲和延伸/收缩分析。对封装的分析表明，整体弯曲变形是由于芯片，模塑料和印刷电路板之间的热膨胀系数不匹配而发生的。研究了温度变化引起的封装的整体和局部详细变形，并研究了它们对MEMS陀螺仪的频移的影响。发现封装变形或封装引起的应力导致MEMS陀螺仪结构的频率偏移。为了增加结构抗变形的强度，用半折叠弹簧代替了“蟹腿”型弹簧。结果表明，施加半折簧后，频率偏移大大减小。在这项工作中，该频移在陀螺仪传感器的公差范围内

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