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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >On-Chip Liquid Cooling With Integrated Pump Technology
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On-Chip Liquid Cooling With Integrated Pump Technology

机译：集成泵技术的片上液体冷却

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摘要

In this paper, the capability of a novel cooling system for microchannels based on the principle of electrowetting is examined. To start with, the electrowetting effect in microchannels is experimentally investigated. The used electrowetting system consists of a liquid droplet deposited on a conductive Si substrate and electrically insulated from this substrate by a dielectric layer. Microchannels of 100 $mu$m $times$ 100 $mu$m are etched in the substrate. By applying an ac voltage signal between the droplet and the substrate, the microchannels can be periodically filled and emptied with the liquid of the droplet. This oscillating liquid flow will be used to cool the chip. For the 100 $mu$m $times$ 100 $mu$m microchannels a voltage of 51 V is required for the actuation.
机译：在本文中，研究了基于电润湿原理的新型微通道冷却系统的功能。首先，通过实验研究微通道中的电润湿效果。所使用的电润湿系统由沉积在导电Si衬底上并通过介电层与该衬底电绝缘的液滴组成。在衬底中蚀刻100μm乘以100μm的微通道。通过在微滴和基板之间施加交流电压信号，微通道可被周期性地填充和排空微滴的液体。这种振荡的液体流将用于冷却芯片。对于100μm乘以100μm的微通道，需要51V的电压来进行致动。

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