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Optimization and modelling methodologies for electro-viscoelastic sandwich design for noise reduction

机译：用于减少噪声的电粘弹性夹层设计的优化和建模方法

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In this paper a multilayered laminated sandwich with viscoelastic core, surface bonded piezoelectric patches and shunted damping is optimized in order to reduce sound radiation. The viscoelastic core is used since it is especially effective in damping higher frequencies while the piezoelectric patches can actuate on the lower end by tuning its circuit accordingly. Firstly, a single objective optimization is conducted to obtain the optimal stacking parameters of the laminate. Secondly, a multi-objective optimization approach is developed to distribute the piezoelectric shunted patches on the top of the sandwich panel, where the objectives are to reduce the weight, the sound radiation, and the number of shunted RL circuits. The sound radiation characteristics of different configurations are assessed by calculating their radiated sound power through the Rayleigh integral. Finite element analyses are conducted with the use of commercial software ANSYS(C) and the optimization procedures are implemented with the use of MATLAB(C) functions.
机译：为了减少声辐射，本文对具有粘弹性芯，表面粘合压电贴片和分流阻尼的多层层压三明治进行了优化。使用粘弹性芯是因为它在阻尼较高的频率方面特别有效，而压电贴片则可以通过相应地调节其电路而在下端启动。首先，进行单目标优化以获得层压板的最佳堆叠参数。其次，开发了一种多目标优化方法，将压电分流贴片分布在夹心板的顶部，目的是减少重量，减少声音辐射和减少分流RL电路的数量。通过计算通过瑞利积分的辐射声功率，可以评估不同配置的声辐射特性。使用商业软件ANSYS（C）进行有限元分析，并使用MATLAB（C）函数实施优化程序。

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