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An Analytical Homogenization Model For Finite Element Modelling Of Corrugated Cardboard

机译：瓦楞纸板有限元建模的解析均质模型

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摘要

In this paper, an analytical homogenization model for corrugated cardboard and its numerical implementation in a shell element are presented. Taking into account the geometric and mechanical properties of the corrugated board components, this homogenization model leads to an elastic stiffness matrix relative to the generalized strains and internal efforts for an equivalent orthotropic plate. Special attentions are paid to the corrugated cardboard behaviours under the transverse shear efforts and torsion moments. Both laminated and sandwich plate theories are studied and some important improvements are proposed. This model is then implemented into a 3-node shell element called T3γl8 for the linear and buckling analyses. The results obtained by the present model are compared to those given by 3D shell simulations and experiments. The comparison shows the efficiency and accuracy of our homogenization model.
机译：本文提出了瓦楞纸板的分析均质化模型及其在壳单元中的数值实现。考虑到瓦楞纸板组件的几何和机械性能，该均质化模型可得出相对于广义应变和等效正交各向异性板内部作用的弹性刚度矩阵。要特别注意瓦楞纸板在横向剪切力和扭矩作用下的行为。研究了层压板和夹层板理论，并提出了一些重要的改进。然后将该模型实施到称为T3γ18的3节点壳单元中，以进行线性和屈曲分析。将本模型获得的结果与3D外壳模拟和实验给出的结果进行比较。比较显示了我们的均质化模型的效率和准确性。

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