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Experimental study on polishing performance of CeO 2 and nano-SiO 2 mixed abrasive

机译：CeO 2和纳米SiO 2混合磨料抛光性能的实验研究

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In this paper, superfine SiO2 nanoparticles are utilized as composite abrasive additive to improve the polishing property of CeO2, which is prepared through chemical precipitation method by rare-earth chloride as raw materials, silicofluoric acid as fluoride, Na2CO3 as modifier, and NH4HCO3 as precipitator. XRD, SEM, particle size analyzer, and atomic force microscopy are applied to characterize the physical structure, morphology, and size distribution. Furthermore, the as-prepared composite abrasive is used to perform chemical mechanical polishing (CMP) experiment on K9 glass to identify the impact of different mass fraction of SiO2 on the CMP property of work materials. The results show that the composite abrasive contained 0.5% SiO2 has the best polishing property, the surface roughness, and material removal rate of glass after polishing can reach at 1.3157?nm and 22.6?nm/min, respectively.
机译：本文采用超细SiO 2 纳米颗粒作为复合磨料添加剂来提高CeO 2 的抛光性能，该稀土是通过稀土氯化物化学沉淀法制备的。原料，氟硅氟酸，Na 2 CO 3 作为改性剂，NH 4 HCO 3 作为沉淀剂。 XRD，SEM，粒度分析仪和原子力显微镜用于表征物理结构，形态和尺寸分布。此外，将所制备的复合磨料用于在K9玻璃上进行化学机械抛光（CMP）实验，以确定SiO 2 的不同质量分数对工作材料CMP性能的影响。结果表明，含0.5％SiO 2 的复合磨料具有最好的抛光性能，表面粗糙度和抛光后玻璃的材料去除率分别达到1.3157？nm和22.6？nm / min，分别。

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