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首页> 外文期刊>International Journal of Electrochemical Science >The Analysis of the Deposition Rate for Continuous Micro-Anode Guided Electroplating Process
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The Analysis of the Deposition Rate for Continuous Micro-Anode Guided Electroplating Process

机译：连续微阳极引导电镀工艺的沉积速率分析

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摘要

The continuous micro-anode guided electroplating (MAGE) has been improved by using real timecontrol of anode elevation rate based on CCD images in the previous research. However, the effectsof choosing different process parameters, such as the applied voltage and the gap distance between theanode and column, had not been fully discussed in the previous work. In order to manage theelectroplating process and obtain the desired column, the relations between the column geometry andthe process parameters are investigated in this paper. The experiment results show thatthe deposition rate is related to the gap distances as well as the applied voltages. By implementing thesystem identification and curve fitting techniques, the transfer functions between the applied voltageand the column deposition rates are established for different gap distances. Based on these functionsand the on-line CCD images, the anode position and the applied voltage will be adjusted real time tomaintain constant gap distance and obtain the desired column geometries.
机译：在先前的研究中，通过使用基于CCD图像的阳极高程速率的实时控制，改进了连续微阳极引导电镀（MAGE）。然而，在先前的工作中尚未充分讨论选择不同工艺参数（例如施加的电压以及阳极与色谱柱之间的间隙距离）的影响。为了管理电镀过程并获得所需的色谱柱，本文研究了色谱柱几何形状与工艺参数之间的关系。实验结果表明，沉积速率与间隙距离以及所施加的电压有关。通过实施系统识别和曲线拟合技术，可以建立不同间隙距离下施加电压与柱沉积速率之间的传递函数。基于这些功能和在线CCD图像，可以实时调整阳极位置和施加的电压，以保持恒定的间隙距离并获得所需的色谱柱几何形状。

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