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首页> 外文期刊>International Journal of Electrochemical Science >Evaluation and Characterization of Thin Films on AISI 9840 by Electrochemical Noise
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Evaluation and Characterization of Thin Films on AISI 9840 by Electrochemical Noise

机译：AISI 9840上薄膜的电化学噪声评估和表征

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Recently researches have been focusing on thin films by sputtering processes deposited on differentsubstrates. Metallic thin films may be formed by a single nanolayer, bilayers or multilayers structuresto combine properties of different materials, also to create specific properties of the structure,especially when it has nanometer scale dimensions. The objective of this study was to optimize thedeposition conditions and the characterization of bilayers of Al/Cr, Cr/Al, on substrates of steel alloys,in order to evaluate their performance under corrosive conditions. Two configurations were designedfor Al and Cr, deposited by a sputtering system V3 with a magnetron, used a pulsed DC source onAISI 9840 steel substrates, the power was 50W, to constant temperature 150 C, with Argon flow of5.8 sccm, deposition time was 15 minutes for each layer. Microstructural characterization of thebilayers was performed by X-ray diffraction (XRD), scanning electron microscopy (SEM),transmission electron microscopy (TEM) and atomic force microscopy (AFM). Electrochemicalpotential noise was evaluated by potentiostat Solartron 1285, programmed data processor CorrWare.The bilayers were adherents and the configuration Al/Cr was more resistant to corrosion.
机译：最近的研究集中在通过溅射工艺沉积在不同基板上的薄膜上。金属薄膜可以由单个纳米层，双层或多层结构形成，以结合不同材料的特性，还可以创建结构的特定特性，特别是当其具有纳米级尺寸时。这项研究的目的是优化沉积条件和在钢合金基底上表征Al / Cr，Cr / Al双层的特性，以评估其在腐蚀性条件下的性能。为铝和铬设计了两种配置，通过带有磁控管的溅射系统V3沉积，在AISI 9840钢基底上使用脉冲直流电源，功率为50W，恒定温度为150 C，氩气流量为5.8 sccm，沉积时间为每层15分钟。通过X射线衍射（XRD），扫描电子显微镜（SEM），透射电子显微镜（TEM）和原子力显微镜（AFM）对双层进行微观结构表征。电化学电位噪声通过恒电位仪Solartron 1285，编程数据处理器CorrWare进行评估。双层是粘附的，并且Al / Cr构型更耐腐蚀。

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