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首页> 外文期刊>International Journal of Electrochemical Science >Field Studies of Corrosion Behaviour of printed circuit board and hot air solder levelling During the Marine Environment of Industrial Pollution
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Field Studies of Corrosion Behaviour of printed circuit board and hot air solder levelling During the Marine Environment of Industrial Pollution

机译：海洋污染工业环境中印刷电路板腐蚀行为和热风焊料整平的现场研究

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摘要

The atmospheric corrosion behaviour of PCB-HASL (electronic materials) in a polluted marineatmosphere environment was investigated by stereology microscope, SEM, EIS, XPS and SKP. It wasfound that deposition of chloride ions and SO2 gas played a pivotal role in atmospheric corrosion,which contributed to an obvious undulation of the corrosion rate. In the late exposure test, theexpansion of the corrosion products gave rise to the abscission of the protective coating layer (Sn),which resulted in substrate Cu directly exposing to atmospheric environment of Xiaomai Island andcausing the Cu gradually corrosion.
机译：通过立体显微镜，SEM，EIS，XPS和SKP研究了PCB-HASL（电子材料）在污染海洋环境中的大气腐蚀行为。发现氯离子和SO 2气体的沉积在大气腐蚀中起关键作用，这导致腐蚀速率明显起伏。在后期暴露试验中，腐蚀产物的膨胀引起保护涂层（Sn）的脱落，这导致基底铜直接暴露于小麦岛的大气环境，并导致铜逐渐腐蚀。

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