Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage

Danilewsky A.N.; Rack A.; Scheel M.

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Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage

机译：实时的直接X射线衍射成像和不规则硅晶圆破损

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《IUCrJ》 |2016年第2期|共7页
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Danilewsky A.N.; Rack A.; Scheel M.;
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中图分类晶体学;
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1. Real-time X-ray diffraction imaging for semiconductor wafer metrology and high temperature in situ experiments [J] . A. N. Danilewsky, J. Wittge, A. Hess, Physica status solidi . 2011,第11期

机译：实时X射线衍射成像技术，用于半导体晶圆计量和高温原位实验
2. X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers [J] . B.K. Tanner, J. Wittge, P. Vagovic, Powder diffraction . 2013,第2期

机译：X射线衍射成像可预测直径450毫米硅晶片中裂纹扩展的度量
3. Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers [J] . J. Stopford, D. Allen, O. Aldrian, Microelectronic Engineering . 2011,第1期

机译：结合使用三维X射线衍射成像和显微拉曼光谱技术对硅片上等离子弧引起的损伤进行无损评估
4. Residual stress of aluminum thin films sputtered on silicon wafers measured by x-ray diffraction [C] . Keisuke Tanaka, Keisaku Ishihara, Yoshiaki Akiniwa Annual conference on applications of X-ray analysis . 1997

机译：X射线衍射测量的硅晶片上溅射铝薄膜的残余应力
5. Mechanical Properties of Photovoltaic Silicon in Relation to Wafer Breakage. [D] . Kulshreshtha, Prashant Kumar. 2011

机译：光伏硅的机械性能与晶圆断裂的关系。
6. Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage [O] . Alexander Rack, Mario Scheel, Andreas N. Danilewsky 2016

机译：实时的直接X射线衍射成像和不规则硅晶圆破损
7. Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage [O] . Alexander Rack, Mario Scheel, Andreas N. Danilewsky 2016

机译：不规则硅片破损的实时直接和衍射X射线成像

Real-time direct and diffraction X-ray imaging of irregular silicon wafer breakage

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