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Analysis for Pull-In Voltage of a Multilayered Micro-Bridge Driven by Electrostatic Force

机译:静电驱动的多层微桥的吸合电压分析

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A trial solution for bending deflection of a multilayered micro-bridge subject to a voltage induced load is presented. The relation between the applied voltage and the displacements of the micro-bridge in the pull-in state is analyzed by energy method. Furthermore, two analytical expressions about normalized displacement and pull-in voltage are carried out. It’s proved that the value of normalized displacement is not influenced by residual stress if axial and shear deformation is ignored. Finally, the theoretical results are compared with that of FEM, and they show good agreement.
机译:提出了一种多层微桥在电压感应载荷作用下弯曲挠度的试验解决方案。通过能量法分析了施加电压与微桥在拉入状态下的位移之间的关系。此外,对归一化位移和吸合电压进行了两个解析表达式。已经证明,如果忽略轴向和剪切变形,则归一化位移的值不受残余应力的影响。最后,将理论结果与有限元方法进行了比较,并显示出良好的一致性。

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