首页> 外文期刊>Revista de metalurgia >Efecto de la velocidad de deformación en la recristalización dinámica de un cobre ETP durante su compresión en caliente con temperatura descendente
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Efecto de la velocidad de deformación en la recristalización dinámica de un cobre ETP durante su compresión en caliente con temperatura descendente

机译:应变速率对ETP铜随温度降低热压缩过程中动态再结晶的影响

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The main purpose of this project is to establish the effect of strain rate in the dynamic recrystallization of an ETP copper during its hot deformation with descending temperature. For this, there were made some tests of hot compression until true deformations close to one, with four strain rates while the temperature was descending. The tests that were made to the two lowest strain rates, showed a multiple peaks dynamic recrystallization with a rise of the tension instead it reaches the steady state, maybe due a continuous decline of the temperature.With the increase of rate the rest of the tests showed simple peak recrystallization and recovering respectively. The experimental results were compared with the results of a simulation based on the Damped Cosine Avrami Model. The simulation produced results closed to those measured during the multiple peaks dynamic recrystallization. These suggest that the application of this Model may be extended to multiple peaks dynamic recrystallization processes with changeable temperature.
机译:该项目的主要目的是建立应变速率对ETP铜随温度下降而热变形过程中动态再结晶的影响。为此,进行了一些热压缩测试,直到温度下降时具有四个应变率的真实变形接近一个。对两个最低应变速率进行的测试显示,随着张力的升高,动态再结晶出现了多个峰值,而不是达到了稳态,这可能是由于温度的持续下降所致。分别显示简单的峰重结晶和恢复。将实验结果与基于阻尼余弦Avrami模型的仿真结果进行了比较。模拟产生的结果接近于多峰动态重结晶过程中测得的结果。这些表明该模型的应用可以扩展到温度变化的多峰动态再结晶过程。

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