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首页> 外文期刊>Journal of Computer and Communications >Reconfigurable Digital Circuits Based on Chip Expander with Integrated Temperature Regulation
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Reconfigurable Digital Circuits Based on Chip Expander with Integrated Temperature Regulation

机译：基于集成温度调节的芯片扩展器的可重构数字电路

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This article is dealing with a development of custom chip expander platform with the possibility of accurate temperature control and integration of additional silicon-based features. Such platform may serve as a useful tool which facilitates the burdens connected with measurement and analysis tasks of experimental semiconductor structures. The devised solution provides the functionality of carrier substrate (Al2O3 compound) with CTE compatibility to the experimental silicon chip and is fully customizable with respect to a particular chip. It also allows achieving an easy fan-out of small-diameter chip terminals into a larger, more convenient area and placement of chip specimens conveniently into space-constrained chamber of the AFM microscopes, probe stations, etc. Real application of the developed chip expander platform is demonstrated in context of digital reconfigurable circuits based on polymorphic electronics. In this case the chip expander with attached polymorphic chip REPOMO is thermally stabilized at an ambient temperature level up to approximately 135。C and its sensitivity to this phenomenon is demonstrated.
机译：本文讨论的是定制芯片扩展器平台的开发，该平台可能具有精确的温度控制和集成其他基于硅的功能的可能性。这样的平台可以用作有用的工具，其减轻与实验半导体结构的测量和分析任务有关的负担。设计的解决方案为实验硅芯片提供了具有CTE兼容性的载体衬底（Al2O3化合物）功能，并且可以针对特定芯片进行完全定制。它还可以实现将小直径芯片端子轻松散开到更大，更方便的区域中，并且可以方便地将芯片标本放置到AFM显微镜，探针台等空间受限的腔室中。开发的芯片扩展器的实际应用在基于多态电子学的数字可重构电路的背景下演示了该平台。在这种情况下，带有多晶型芯片REPOMO的芯片扩展器可在高达约135℃的环境温度下热稳定，并证明了其对这种现象的敏感性。

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