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首页> 外文期刊>Journal of the Ceramic Society of Japan >Mechanical strength of low-temperature co-fired ceramic multi-layered substrate
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Mechanical strength of low-temperature co-fired ceramic multi-layered substrate

机译：低温共烧陶瓷多层基板的机械强度

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摘要

We developed a structure of a mechanical-strength-enhanced low-temperature co-fired ceramic (LTCC) substrate using two LTCC materials with different thermal expansion coefficients ( TECs ). In this structure, the top and bottom surface layers are made of a material with a lower TEC and the internal layers are made of another material with a higher TEC . Because compressive stress was thought to be exerted in the surface layer due to the differences in the TECs between two materials, it was expected that the compressive stress would reinforce the surface. We found that the bending strength of the substrate was more than 400 MPa and considerably higher than that of each material. The results of stress analysis using the finite element method indicate that the fracture stress of the internal layer considerably exceeded the mechanical strength of the material comprising the internal layer. This is thought to be the cause of mechanical strength enhancement. Therefore, this proposed structure is promising for thinner multilayer substrates.
机译：我们使用两种具有不同热膨胀系数（TEC）的LTCC材料，开发了一种机械强度增强的低温共烧陶瓷（LTCC）基板的结构。在这种结构中，顶表面层和底表面层由具有较低TEC的材料制成，而内层由具有较高TEC的另一材料制成。由于认为由于两种材料之间的TECs差异而在表面层中施加了压应力，因此预期该压应力会增强表面。我们发现，基板的弯曲强度大于400 MPa，远高于每种材料的弯曲强度。使用有限元方法进行应力分析的结果表明，内层的断裂应力大大超过了组成内层的材料的机械强度。认为这是机械强度提高的原因。因此，该提出的结构对于更薄的多层基板是有希望的。

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