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Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation

机译：分子动力学模拟激光纳米结构金刚石工具对硅切削性能的影响

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In this study, a series of large-scale molecular dynamics simulations have been performed to study the nanometric cutting of single crystal silicon with a laser-fabricated nanostructured diamond tool. The material removal behavior of the workpiece using a structured diamond tool cutting is studied. The effects of groove direction, depth, width, factor, and shape on material deformation are carefully investigated by analyzing normal stresses, shear stress, von Mises stress, hydrostatic stress, phase transformation, cutting temperature, cutting force and friction coefficients. Simulation results show that a cutting tool groove orientation of 60° produces a smaller cutting force, less cutting heat, more beta-silicon phase, and less von Mises stress and hydrostatic stress. Moreover, tools with a smaller groove orientation, groove depth and groove width, and larger groove factor lead to more ductile cutting and an increased material removal rate. However, a cutting tool with a smaller groove width results in more heat during the nanoscale cutting process. In addition, the average temperature of the subsurface increases as groove factor increases, showing that a tool groove accelerates heat dissipation to the subsurface atoms. Furthermore, this V-shape groove cutting is shown to improve material removal ability in nanoscale cutting.
机译：在这项研究中，已进行了一系列大规模的分子动力学模拟，以研究用激光加工的纳米结构金刚石工具对单晶硅进行纳米切割。研究了使用结构化金刚石刀具切削工件的材料去除行为。通过分析正应力，切应力，冯·米塞斯应力，静水应力，相变，切削温度，切削力和摩擦系数，仔细研究了凹槽方向，深度，宽度，因子和形状对材料变形的影响。仿真结果表明，刀具凹槽方向为60°时，切削力较小，切削热较小，β-硅相较多，冯·米塞斯应力和静液压应力较小。而且，具有较小的凹槽定向，凹槽深度和凹槽宽度以及较大的凹槽系数的工具可导致更易延展的切削和更高的材料去除率。但是，具有较小凹槽宽度的切削工具会在纳米级切削过程中产生更多的热量。另外，随着凹槽系数的增加，地下的平均温度也随之增加，这表明工具凹槽加速了对地下原子的散热。此外，该V形凹槽切割显示出可提高纳米级切割中的材料去除能力。

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