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首页> 外文期刊>RSC Advances >Polysulfone foam with high expansion ratio prepared by supercritical carbon dioxide assisted molding foaming method
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Polysulfone foam with high expansion ratio prepared by supercritical carbon dioxide assisted molding foaming method

机译：超临界二氧化碳辅助成型发泡法制得的高膨胀率聚砜泡沫

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Polysulfone (PSU) is considered as an important candidate for the fabrication of high-performance microcellular polymers, but the preparation of PSU foam with a high expansion ratio still remains a big challenge worldwide. In this study, high expansion ratio PSU foam was successfully prepared by a supercritical carbon dioxide (CO2) assisted molding foaming method. The foaming behavior of PSU under supercritical CO2 was systematically studied in various process conditions and different microcellular structures were created in PSU foams. The results showed that foaming temperature and CO2 concentration were the key factors to obtain microcellular foams with tailored microstructures. The cellular structure and expansion ratio of PSU foam obviously changed with different foaming temperatures. The expansion ratio and average cell size firstly increased and then decreased as foaming temperature increased. However, the cell density decreased and then remained stable as foaming temperature increased. The maximum expansion ratio of 11.0 was reached at the optimum foaming temperature of 200?°C. Cellular structure and morphologies of the foam changed obviously at CO2 concentrations below 5% and remained stable at CO2 concentrations above 5%. Finally, the prepared PSU foams exhibit excellent mechanical strength, good thermal conductivity, and superb heat retardancy, thus may have great potential application as a kind of substitute material in the electrical wire and cable industry, railway and steamer transportation, oil and gas platforms, military use and in other fields.
机译：聚砜（PSU）被认为是制造高性能微孔聚合物的重要候选者，但是在全球范围内，制备具有高膨胀率的PSU泡沫仍然是一个巨大的挑战。本研究通过超临界二氧化碳（CO 2 ）辅助成型发泡方法成功制备了高膨胀比的PSU泡沫。在各种工艺条件下，系统研究了超临界CO 2 条件下PSU的发泡行为，并在PSU泡沫中形成了不同的微孔结构。结果表明，发泡温度和CO 2 浓度是获得具有定制微结构的微孔泡沫的关键因素。 PSU泡沫的孔结构和膨胀率随发泡温度的不同而发生明显变化。随着发泡温度的升高，膨胀率和平均泡孔尺寸先增大然后减小。但是，随着发泡温度的升高，泡孔密度降低，然后保持稳定。在最佳发泡温度200？C时，最大膨胀比达到11.0。当CO 2 浓度低于5％时，泡沫的细胞结构和形态发生明显变化，而在CO 2 浓度下保持稳定浓度高于5％。最后，制得的PSU泡沫材料具有优异的机械强度，良好的导热性和极好的耐热性，因此作为电线电缆行业，铁路和轮船运输，石油和天然气平台中的替代材料，具有巨大的潜在应用前景。军事用途和其他领域。

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