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Interface-governed nanometric machining behaviour of Cu/Ag bilayers using molecular dynamics simulation

机译：使用分子动力学模拟对界面控制的Cu / Ag双层纳米加工行为

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The nanometric machining of Cu/Ag bilayers and pure Cu film is performed using molecular dynamics (MD) simulations. The mechanical and tribological properties of Cu/Ag bilayers are investigated by comparing with those of pure Cu film. The effects of machining parameters (indenter radius, tool speed and machining depth) on the subsurface damage and material removal are studied by analyzing the dislocation movement, chipping volume, machining force and average temperature of the workpiece. The results show that the hardness of Cu/Ag bilayers is smaller than that of pure Cu film, due to the dislocation nucleation and emission from the Cu/Ag interface. Meanwhile, the friction coefficient of Cu/Ag bilayers is larger than that of pure Cu film. Furthermore, the metal bonding energy at the Cu/Ag interface is weaker than that in pure Cu film, which causes the low hardness in the Cu/Ag bilayers. The Young's moduli in the Cu/Ag bilayers and pure Cu film are calculated by the Hertz contact mechanism and are close to the experimental result. During nanometric machining of Cu/Ag bilayers, the larger indenter radius or higher tool speed would cause a larger indentation force. The chipping volume, machining force and average temperature would increase with the increment of indenter radius, tool speed and machining depth. The subsurface damage can be reduced by selecting the smaller indenter radius, lower tool speed, and smaller machining depth, where fewer lattice defects are produced. In addition, the selection of lower tool speed also plays a crucial role in improving the smoothness of the ground surface.
机译：使用分子动力学（MD）模拟对Cu / Ag双层和纯Cu膜进行纳米加工。通过与纯铜薄膜的比较，研究了铜/银双层的机械和摩擦学性能。通过分析位错运动，切屑体积，加工力和工件的平均温度，研究了加工参数（压头半径，刀具速度和加工深度）对表面损伤和材料去除的影响。结果表明，由于位错形核和从Cu / Ag界面的发射，Cu / Ag双层的硬度小于纯Cu膜的硬度。同时，Cu / Ag双层的摩擦系数大于纯Cu膜的摩擦系数。此外，Cu / Ag界面处的金属结合能比纯Cu膜中的弱，这导致Cu / Ag双层的硬度较低。 Cu / Ag双层膜和纯Cu膜中的杨氏模量是通过赫兹接触机理计算的，接近实验结果。在对Cu / Ag双层进行纳米加工时，较大的压头半径或较高的工具速度会导致较大的压头力。切屑的体积，加工力和平均温度会随着压头半径，刀具速度和加工深度的增加而增加。通过选择较小的压头半径，较低的刀具速度和较小的加工深度（可产生较少的晶格缺陷），可以减少表面下的损坏。此外，选择较低的刀具速度在提高地面光滑度方面也起着至关重要的作用。

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