• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>RSC Advances >Enhanced toughness and thermal conductivity for epoxy resin with a core–shell structured polyacrylic modifier and modified boron nitride
【24h】

Enhanced toughness and thermal conductivity for epoxy resin with a core–shell structured polyacrylic modifier and modified boron nitride

机译：核-壳结构的聚丙烯酸改性剂和改性氮化硼可增强环氧树脂的韧性和导热性

获取原文
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

A new epoxy-based composite with higher toughness and thermal conductivity was developed. First, a poly( n -butyl acrylate)/poly(methyl methacrylate- co -glycidyl methacrylate) (PBMG) core–shell structured latex was prepared by seeded emulsion polymerization to toughen the epoxy resin (EP). Second, boron nitride particles were modified into nano-scale sheets and added to the epoxy/PBMG blend to improve the thermal conductivity of the resulting composite material. The properties of the constituent materials were determined prior to fabrication and testing of the composite product. The monomer conversion in the emulsion polymerization process of the PBMG was checked by determining the solid particle content. The PBMG particle size was characterized by dynamic laser scattering, and the morphology of the particles was characterized by scanning and transmission electron microscopy. The exfoliation of the modified boron nitride (MBN) flakes was verified by TEM and Raman microscopy. The mechanical properties and the thermal conductivity of the EP/PBMG/MBN composite were determined at various constituent contents. Results showed that the unnotched impact strength of the composite increased by 147%, the flexural strength increased by 49.1%, and the thermal conductivity increased by 98% compared with pristine EP at a PBMG content of 5 wt% and MBN content of 7 wt%. With the enhanced properties and ease of fabrication, the developed composite has good potential for application in high-end industries such as microelectronics packaging.
机译：开发了一种具有更高韧性和导热性的新型环氧复合材料。首先，通过种子乳液聚合来制备聚（丙烯酸正丁酯）/聚（甲基丙烯酸甲酯-甲基丙烯酸共缩水甘油酯）（PBMG）核壳结构胶乳，以增韧环氧树脂（EP）。第二，将氮化硼颗粒改性为纳米级片材，然后添加到环氧/ PBMG混合物中，以提高所得复合材料的导热性。在制造和测试复合产品之前确定组成材料的性能。通过测定固体颗粒含量来检查PBMG的乳液聚合过程中的单体转化率。通过动态激光散射表征PBMG的粒径，并通过扫描和透射电子显微镜表征颗粒的形态。改性的氮化硼（MBN）薄片的剥落通过TEM和拉曼显微镜证实。在各种组成含量下确定EP / PBMG / MBN复合材料的机械性能和导热系数。结果表明，与原始EP相比，PBMG含量为5 wt％，MBN含量为7 wt％时，复合材料的无缺口冲击强度提高了147％，弯曲强度提高了49.1％，导热系数提高了98％ 。具有增强的性能和易于制造的特性，开发出的复合材料在高端行业（如微电子封装）中具有良好的应用潜力。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号