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Enhanced toughness and thermal conductivity for epoxy resin with a core-shell structured polyacrylic modifier and modified boron nitride

机译：用芯壳结构化聚丙烯酸酯改性剂和改性硼氮化物增强环氧树脂的韧性和导热率

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摘要

A new epoxy-based composite with higher toughness and thermal conductivity was developed. First, a poly(n-butyl acrylate)/ poly(methyl methacrylate-co-glycidyl methacrylate) (PBMG) core-shell structured latex was prepared by seeded emulsion polymerization to toughen the epoxy resin (EP). Second, boron nitride particles were modified into nano-scale sheets and added to the epoxy/ PBMG blend to improve the thermal conductivity of the resulting composite material. The properties of the constituent materials were determined prior to fabrication and testing of the composite product. The monomer conversion in the emulsion polymerization process of the PBMG was checked by determining the solid particle content. The PBMG particle size was characterized by dynamic laser scattering, and the morphology of the particles was characterized by scanning and transmission electron microscopy. The exfoliation of the modified boron nitride (MBN) flakes was verified by TEM and Raman microscopy. The mechanical properties and the thermal conductivity of the EP/ PBMG/ MBN composite were determined at various constituent contents. Results showed that the unnotched impact strength of the composite increased by 147%, the flexural strength increased by 49.1%, and the thermal conductivity increased by 98% compared with pristine EP at a PBMG content of 5 wt% and MBN content of 7 wt%. With the enhanced properties and ease of fabrication, the developed composite has good potential for application in high-end industries such as microelectronics packaging.
机译：开发了一种具有更高韧性和导热性的新的环氧基复合材料。首先，通过种子的乳液聚合制备聚（正丁基丙烯酸酯）/聚（甲基丙烯酸甲酯 - 共缩水甘油甲基丙烯酸甲基丙烯酸酯）（PBMG）核 - 壳结构胶乳以加强环氧树脂（EP）。其次，将氮化硼颗粒改性为纳米级片，并加入环氧树脂/ PBMG混合物中，以改善所得复合材料的导热率。在制造和测试复合产品之前测定组成材料的性质。通过确定固体颗粒含量检查PBMG的乳液聚合过程中的单体转化。通过动态激光散射的特征在于PBMG粒径，并且通过扫描和透射电子显微镜表征颗粒的形态。通过TEM和拉曼显微镜验证改性氮化硼（MBN）薄片的剥离。在各种组成含量确定EP / PBMG / MBN复合物的机械性能和导热率。结果表明，复合材料的不排气冲击强度增加了147％，弯曲强度增加了49.1％，导热率增加了98％，与PBMG含量为5wt％和MBN含量为7wt％ 。通过增强的性能和易于制造，开发的复合材料具有良好的应用在微电子包装等高端工业中的应用。

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  • 来源
    《RSC Advances》 |2019年第15期|共10页
  • 作者

    Xu Chen; Qu Taoguang; Zhang Xiaojie; Qu Xiongwei; Wang Nongyue; Zhang Qingxin; Abdel-Magid Beckry; Li Guohua;

  • 作者单位

    Hebei Univ Technol Sch Chem Engn Inst Polymer Sci &

    Engn Tianjin 300130 Peoples R China;

    Beijing Univ Chem Technol Coll Mat Sci &

    Engn Beijing 100029 Peoples R China;

    Hebei Univ Technol Sch Chem Engn Inst Polymer Sci &

    Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Chem Engn Inst Polymer Sci &

    Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Chem Engn Inst Polymer Sci &

    Engn Tianjin 300130 Peoples R China;

    Hebei Univ Technol Sch Chem Engn Inst Polymer Sci &

    Engn Tianjin 300130 Peoples R China;

    Winona State Univ Dept Composite Mat Engn Winona MN 55987 USA;

    Hebei Univ Technol Sch Chem Engn Inst Polymer Sci &

    Engn Tianjin 300130 Peoples R China;

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